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• Gain = 20x for LMP8601 and LMP8601-Q1
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• Gain = 50x for LMP8602 and LMP8602-Q1
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• Gain = 100x for LMP8603 and LMP8603-Q1
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• TCVOS: 10 μV/°C Maximum
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• CMRR: 90-dB Minimum
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• Input Offset Voltage: 1-mV Maximum
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• CMVR at VS = 5 V: –22 V to 60 V
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• Single-Supply Bidirectional Operation
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• All Minimum and Maximum Limits 100% Tested
|
• Q1 Devices Qualified for Automotive Applications
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• Q1 Devices ACE-Q100 Qualified With the Following Results:– Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
– Device Temperature Grade 0: –40°C to 150°C (LMP8601EDRQ1 Only)– Device HBM ESD Classification Level 2(3A on inputs)– Device CDM ESD Classification Level C6– Device MM ESD Classification Level M2
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| CATALOG |
LMP8601MAX/NOPB COUNTRY OF ORIGIN
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LMP8601MAX/NOPB PARAMETRIC INFO
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LMP8601MAX/NOPB PACKAGE INFO
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LMP8601MAX/NOPB MANUFACTURING INFO
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LMP8601MAX/NOPB PACKAGING INFO
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LMP8601MAX/NOPB ECAD MODELS
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LMP8601MAX/NOPB APPLICATIONS
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COUNTRY OF ORIGIN
|
China
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Malaysia
|
Mexico
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PARAMETRIC INFO
|
| Type |
Current Sense Amplifier |
| Number of Elements per Chip |
1 |
| Number of Channels per Chip |
1 |
| Minimum PSRR (dB) |
90(Typ) |
| Maximum Input Offset Voltage (mV) |
1@5V |
| Minimum CMRR (dB) |
80 |
| Minimum CMRR Range (dB) |
75 to 85 |
| Maximum Input Resistance (MOhm) |
0.59(Typ)@5V |
| Minimum Slew Rate (V/us) |
0.6@5V |
| Typical Slew Rate (V/us) |
0.83@5V |
| Maximum Voltage Gain Range (dB) |
<35 |
| Maximum Voltage Gain (dB) |
26.06 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single |
| Maximum Supply Voltage Range (V) |
5 to 7 |
| Minimum Single Supply Voltage (V) |
3 |
| Typical Single Supply Voltage (V) |
5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
1.1(Typ)@5V |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
|
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| APPLICATIONS |
• High-Side and Low-Side Driver Configuration Current Sensing
|
| • Bidirectional Current Measurement |
| • Current Loop to Voltage Conversion |
| • Automotive Fuel Injection Control |
| • Transmission Control |
| • Power Steering |
| • Battery Management Systems |
| |
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