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• 4 V to 40 V Input Range
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• 5 A Continuous Output Current
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• Ultra-low 40 µA Operating Quiescent Current
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• 90 mΩ High-Side MOSFET |
• Minimum Switch-On Time: 75 ns |
• Current Mode Control |
• Adjustable Switching Frequency from 200 kHz to 2.5 MHz |
• Frequency Synchronization to External Clock |
• Internal Compensation for Ease of Use |
• High Duty Cycle Operation Supported |
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CATALOG |
LMR14050SDDAR COUNTRY OF ORIGIN |
LMR14050SDDAR PARAMETRIC INFO
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LMR14050SDDAR PACKAGE INFO
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LMR14050SDDAR MANUFACTURING INFO
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LMR14050SDDAR PACKAGING INFO
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LMR14050SDDAR EACD MODELS
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LMR14050SDDAR APPLICATIONS |
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COUNTRY OF ORIGIN |
Philippines |
Mexico |
China |
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PARAMETRIC INFO
|
Type |
Synchronous Step Down |
Number of Outputs |
1 |
Minimum Input Voltage (V) |
4 |
Maximum Input Voltage (V) |
40 |
Output Voltage (V) |
1 to 36 |
Maximum Output Current (A) |
5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Switching Frequency (kHz) |
200 to 2500 |
Switching Regulator |
Yes |
Operating Supply Voltage (V) |
4 to 40 |
Output Type |
Adjustable |
Typical Quiescent Current (uA) |
40 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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Supplier Package |
HSOIC EP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.55(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.7(Max) |
Seated Plane Height (mm) |
1.7(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Family Name |
SO |
Jedec |
MS-012-BA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au|AuAg |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
12.8 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS |
•
Automotive Battery Regulation
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• Industrial Power Supplies |
• Telecom and Datacom Systems |
• Battery Powered System |
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