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• Functional Safety-Capable– Documentation available to aid functional safety system design
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• Low EMI and switching noise– HotRod™ package– Parallel input current paths
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• High power conversion at all loads– Peak efficiency > 95%– Low operating quiescent current of 25 µA
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• Flexible system interface– Power-good flag and precision enable
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| CATALOG |
LMR33630ADDAR COUNTRY OF ORIGIN
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LMR33630ADDAR PARAMETRIC INFO
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LMR33630ADDAR PACKAGE INFO
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LMR33630ADDAR MANUFACTURING INFO
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LMR33630ADDAR PACKAGING INFO
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LMR33630ADDAR ECAD MODELS
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LMR33630ADDAR APPLICATIONS
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COUNTRY OF ORIGIN
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Mexico
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China
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Malaysia
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PARAMETRIC INFO
|
| Type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
3.8 |
| Maximum Input Voltage (V) |
36 |
| Output Voltage (V) |
1 to 24 |
| Maximum Output Current (A) |
3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Switching Frequency (kHz) |
400(Typ) |
| Efficiency (%) |
95(Min) |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
3.8 to 36 |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
24 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Switch Current (A) |
4.5 |
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PACKAGE INFO
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| Supplier Package |
HSOIC EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.55(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.7(Max) |
| Seated Plane Height (mm) |
1.7(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Family Name |
SO |
| Jedec |
MS-012-BA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au|AuAg |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
N/A|Cu Alloy |
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PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Motor drive systems: drones, AC inverters,VF drives, servos |
| • Factory and building automation systems:PLC CPU, HVAC control, elevator control |
| • General purpose wide VIN powers |
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