 |
|
| • Input Voltage Range of 2.7V to 14V |
| • Output Voltage up to 20V |
| • Switch Current up to 1.4A |
| • 1.6 MHz Switching Frequency |
| • Low Shutdown Iq, <1 µA |
| • Cycle-by-Cycle Current Limiting |
| • Internally Compensated |
| • 5-Pin SOT-23 Packaging (2.92 x 2.84 x 1.08mm) |
| • Fully Enabled for WEBENCH® Power Designer |
|
| CATALOG |
| LMR62014XMF/NOPB COUNTRY OF ORIGIN |
| LMR62014XMF/NOPB PARAMETRIC INFO |
| LMR62014XMF/NOPB PACKAGE INFO |
| LMR62014XMF/NOPB MANUFACTURING INFO |
| LMR62014XMF/NOPB PACKAGING INFO |
| LMR62014XMF/NOPB APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Malaysia |
| Philippines |
| Thailand |
|
| PARAMETRIC INFO |
| Type |
Step Up |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
2.7 |
| Maximum Input Voltage (V) |
14 |
| Output Voltage (V) |
3 to 20 |
| Maximum Output Current (A) |
1.4 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Switching Frequency (kHz) |
1600(Typ) |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
-0.4 to 14.5 |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
2000 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Switch Current (A) |
2 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.05(Max) |
| Package Width (mm) |
1.75(Max) |
| Package Height (mm) |
1.1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.05(Max) |
| Package Overall Width (mm) |
3(Max) |
| Package Overall Height (mm) |
1.45(Max) |
| Seated Plane Height (mm) |
1.45(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178 |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
4 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
|
| |
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
| |
| APPLICATIONS |
| • Boost Conversions from 3.3V, 5V, and 12V
Rails |
| • Space Constrained Applications |
| • Embedded Systems |
| • LCD Displays |
| • LED Applications |
|
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