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|
• Operation from 2.7 V to 5.0 V Single−Sided Power Supply
|
• LMV321 Single Available in Ultra Small 5 Pin SC70 Package
|
• No Output Crossover Distortion
|
• Rail−to−Rail Output
|
• Low Quiescent Current: LMV358 Dual − 220 A, Max per Channel
|
| • No Output Phase−Reversal from Overdriven Input |
| • NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable |
| • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant |
|
| CATALOG |
LMV324DTBR2G COUNTRY OF ORIGIN
|
LMV324DTBR2G PARAMETRIC INFO
|
LMV324DTBR2G PACKAGE INFO
|
LMV324DTBR2G MANUFACTURING INFO
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LMV324DTBR2G PACKAGING INFO
|
LMV324DTBR2G ECAD MODELS
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LMV324DTBR2G APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Philippines
|
|
PARAMETRIC INFO
|
| Manufacturer Type |
Low Voltage Amplifier |
| Type |
Low Voltage Amplifier |
| Rail to Rail |
Rail to Rail Output |
| Minimum Single Supply Voltage (V) |
2.7 |
| Number of Channels per Chip |
4 |
| Minimum PSRR (dB) |
50 |
| Typical Single Supply Voltage (V) |
3 |
| Maximum Single Supply Voltage (V) |
5 |
| Output Type |
CMOS |
| Typical Gain Bandwidth Product (MHz) |
1 |
| Maximum Input Offset Voltage (mV) |
9@5V@-40C to 85C |
| Maximum Input Offset Current (uA) |
0.001(Typ)@5V@-40C to 85C |
| Maximum Operating Supply Voltage (V) |
5 |
| Minimum CMRR (dB) |
50 |
| Maximum Supply Voltage Range (V) |
<5.5 |
| Minimum CMRR Range (dB) |
50 to 60 |
| Typical Voltage Gain (dB) |
100 |
| Typical Slew Rate (V/us) |
1@5V |
| Typical Output Current (mA) |
160 |
| Typical Input Noise Voltage Density (nV/rtHz) |
50@5V |
| Typical Input Bias Current (uA) |
0.001@5V@-40C to 85C |
| Shut Down Support |
No |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Power Supply Type |
Single |
| Maximum Supply Current (mA) |
0.83@5V |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP W |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
14 |
| Lead Shape |
Gull-wing |
| PCB |
14 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5.1(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.1(Max) |
| Package Overall Width (mm) |
6.4 |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AB-1 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R2 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
|
|
ECAD MODELS
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APPLICATIONS
|
• Notebook Computers and PDA’s
|
| • Portable Battery−Operated Instruments |
• Active Filters
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| |
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