LMV331IDBVR Texas Instruments IC GP LV COMPARATOR SOT-23-5

label:
2023/09/13 327


• 2.7-V and 5-V Performance
• Low Supply Current
   – LMV331 130 μA Typ
   – LMV393 210 μA Typ
   – LMV339 410 μA Typ  
• Input Common-Mode Voltage Range Includes Ground
• Low Output Saturation Voltage 200 mV Typical  
• Open-Collector Output for Maximum Flexibility


CATALOG
LMV331IDBVR COUNTRY OF ORIGIN
LMV331IDBVR PARAMETRIC INFO
LMV331IDBVR PACKAGE INFO
LMV331IDBVR MANUFACTURING INFO
LMV331IDBVR PACKAGING INFO
LMV331IDBVR ECAD MODELS
LMV331IDBVR FUNCTIONAL BLOCK DIAGRAM  
LMV331IDBVR APPLICATIONS


COUNTRY OF ORIGIN
China
Germany
Malaysia
Philippines
Thailand


PARAMETRIC INFO
Rail to Rail Rail to Rail Output
Manufacturer Type Low Voltage Comparator
Number of Channels per Chip 1
Output Type Open Collector
Maximum Input Offset Voltage (mV) 7@5V
Maximum Input Bias Current (uA) 0.25@5V
Typical Voltage Gain (dB) 93.98
Typical Voltage Gain Range (dB) 90 to 110
Strobe Capability No
Typical Output Current (mA) 84@5V
Typical Input Offset Current (uA) 0.002@5V
Maximum Input Offset Current (uA) 0.05@5V
Maximum Propagation Delay Time (ns) 600(Typ)
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single
Integrated Voltage Reference No
Maximum Test Temperature (°C) 125
Minimum Test Temperature (°C) -40
Maximum Operating Supply Voltage (V) 5.5
Integrated OP Amp No
Minimum Single Supply Voltage (V) 2.7
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.5
Maximum Supply Current (mA) 0.12@5V
 

PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.05(Max)
Package Width (mm) 1.75(Max)
Package Height (mm) 1.1
Package Diameter (mm) N/R
Package Overall Length (mm) 3.05(Max)
Package Overall Width (mm) 3(Max)
Package Overall Height (mm) 1.45(Max)
Seated Plane Height (mm) 1.45(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178
 

MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 4
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R
 

PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Reel Width (mm) 9
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q3
Packaging Document Link to Datasheet
 

ECAD MODELS


FUNCTIONAL BLOCK DIAGRAM  

 
APPLICATIONS
• Hysteresis Comparators  
• Oscillators  
• Window Comparators
• Industrial Equipment
• Test and Measurement


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