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• (For 5-V Supply, Typical Unless Otherwise Noted)
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• Ensured 2.7-V and 5-V Performance
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• Industrial Temperature Range −40°C to 85°C
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• Low Supply Current 60 µA/Channel
|
• Input Common Mode Voltage Range Includes Ground
|
• Low Output Saturation Voltage 200 mV
|
• Propagation Delay 200 ns
|
• Space-Saving 5-Pin SC70 and 5-Pin SOT23 Packages
|
|
| CATALOG |
LMV339MX/NOPB COUNTRY OF ORIGIN
|
LMV339MX/NOPB PARAMETRIC INFO
|
LMV339MX/NOPB PACKAGE INFO
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LMV339MX/NOPB MANUFACTURING INFO
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LMV339MX/NOPB PACKAGING INFO
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LMV339MX/NOPB ECAD MODELS
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LMV339MX/NOPB APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Mexico
|
China
|
Malaysia
|
|
PARAMETRIC INFO
|
| Rail to Rail |
Rail to Rail Output |
| Manufacturer Type |
Low Voltage Comparator |
| Process Technology |
BiCMOS |
| Number of Channels per Chip |
4 |
| Output Type |
Open Collector |
| Maximum Input Offset Voltage (mV) |
7@5V |
| Maximum Input Bias Current (uA) |
0.25@5V |
| Maximum Input Voltage Range (V) |
4.2(Typ) |
| Typical Voltage Gain (dB) |
93.98 |
| Typical Voltage Gain Range (dB) |
90 to 110 |
| Strobe Capability |
No |
| Typical Output Current (mA) |
84@5V |
| Typical Input Offset Current (uA) |
0.002@5V |
| Maximum Input Offset Current (uA) |
0.05@5V |
| Maximum Propagation Delay Time (ns) |
600(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Supplier Temperature Grade |
Industrial |
| Power Supply Type |
Single |
| Maximum Operating Supply Voltage (V) |
5 |
| Integrated Voltage Reference |
No |
| Maximum Test Temperature (°C) |
85 |
| Minimum Test Temperature (°C) |
-40 |
| Minimum Single Supply Voltage (V) |
2.7 |
| Integrated OP Amp |
No |
| Typical Single Supply Voltage (V) |
3 |
| Maximum Single Supply Voltage (V) |
5 |
| Maximum Supply Current (mA) |
0.3@5V |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
14 |
| Lead Shape |
Gull-wing |
| PCB |
14 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
8.75(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
8.75(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
X |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Mobile Communications
|
• Notebooks and PDAs
|
• Battery-Powered Electronics
|
• General-Purpose Portable Devices
|
| • General-Purpose, Low-Voltage Applications |
| |
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