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• 2.7-V and 5-V Performance
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• Rail-to-Rail Output Swing
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• Input Bias Current:1 pA (Typical)
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• Input Offset Voltage: 0.25 mV (Typical)
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• Low Supply Current: 100 μA (Typical)
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• Low Shutdown Current: 45 pA (Typical)
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| CATALOG |
LMV342IDGKR COUNTRY OF ORIGIN
|
LMV342IDGKR PARAMETRIC INFO
|
LMV342IDGKR PACKAGE INFO
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LMV342IDGKR MANUFACTURING INFO
|
LMV342IDGKR PACKAGING INFO
|
LMV342IDGKR ECAD MODELS
|
LMV342IDGKR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
China
|
Thailand
|
Malaysia
|
Philippines
|
|
PARAMETRIC INFO
|
| Manufacturer Type |
Low Voltage Amplifier |
| Type |
Low Voltage Amplifier |
| Rail to Rail |
Rail to Rail Output |
| Number of Channels per Chip |
2 |
| Minimum Single Supply Voltage (V) |
2.5 |
| Process Technology |
CMOS |
| Typical Single Supply Voltage (V) |
3|5 |
| Output Type |
CMOS |
| Maximum Single Supply Voltage (V) |
5.5 |
| Typical Gain Bandwidth Product (MHz) |
1 |
| Maximum Input Offset Voltage (mV) |
4@5V |
| Maximum Input Bias Current (uA) |
0.0002@5V |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Supply Voltage Range (V) |
5.5 to 6 |
| Minimum CMRR (dB) |
56 |
| Minimum CMRR Range (dB) |
50 to 60 |
| Typical Voltage Gain (dB) |
116 |
| Typical Input Offset Current (uA) |
0.0000000066@5V |
| Typical Slew Rate (V/us) |
1@5V |
| Typical Input Noise Voltage Density (nV/rtHz) |
39@5V |
| Typical Input Bias Current (uA) |
0.000001@5V |
| Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.001@5V |
| Shut Down Support |
No |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended Industrial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single |
| Maximum Supply Current (mA) |
0.4@5V |
| Input Offset Voltage Drift (uV/°C) |
1.9(Typ) |
|
|
PACKAGE INFO
|
| Supplier Package |
VSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
0.95 |
| Minimum PACKAGE_DIMENSION_H |
N/A |
| Maximum PACKAGE_DIMENSION_L |
3.1 |
| Minimum PACKAGE_DIMENSION_L |
2.9 |
| Maximum PACKAGE_DIMENSION_W |
3.1 |
| Minimum PACKAGE_DIMENSION_W |
2.9 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.1 |
| Minimum Seated_Plane_Height |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Cordless and Cellular Phones |
| • Consumer Electronics (Laptops, PDAs) |
| • Audio Preamplifiers for Voice |
| • Portable, Battery-Powered Electronic Equipment |
| |
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