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• AEC-Q100 qualified for automotive applications– Temperature grade 1: –40°C to +125°C, TA– Device HBM ESD classification level 2– Device CDM ESD classification level C6
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• Low input offset voltage: ±1 mV
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• Rail-to-rail output
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• Unity-gain bandwidth: 1 MHz
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• Low broadband noise: 30 nV/√ Hz
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• Low input bias current: 10 pA
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• Low quiescent current: 70 µA/Ch
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• Unity-gain stable
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• Internal RFI and EMI filter
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• Operational at supply voltages as low as 2.5 V
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• Easier to stabilize with higher capacitive load due to resistive open-loop output impedance
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• Extended temperature range: –40°C to 125°C
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CATALOG |
LMV358AQDGKRQ1 COUNTRY OF ORIGIN
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LMV358AQDGKRQ1 PARAMETRIC INFO
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LMV358AQDGKRQ1 PACKAGE INFO
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LMV358AQDGKRQ1 MANUFACTURING INFO
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LMV358AQDGKRQ1 PACKAGING INFO
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LMV358AQDGKRQ1 ECAD MODELS
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LMV358AQDGKRQ1 APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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China
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Thailand
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PARAMETRIC INFO
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Manufacturer Type |
Low Voltage Amplifier |
Type |
Low Voltage Amplifier |
Rail to Rail |
Rail to Rail Output |
Minimum Single Supply Voltage (V) |
2.5 |
Number of Channels per Chip |
2 |
Minimum PSRR (dB) |
78 |
Typical Single Supply Voltage (V) |
3|5 |
Maximum Single Supply Voltage (V) |
5.5 |
Minimum Dual Supply Voltage (V) |
±1.25 |
Typical Gain Bandwidth Product (MHz) |
1 |
Maximum Input Offset Voltage (mV) |
4@5V |
Maximum Dual Supply Voltage (V) |
±2.75 |
Maximum Operating Supply Voltage (V) |
±2.75|5.5 |
Minimum CMRR (dB) |
63 |
Maximum Supply Voltage Range (V) |
5.5 to 6 |
Minimum CMRR Range (dB) |
60 to 65 |
Typical Voltage Gain (dB) |
128 |
Typical Slew Rate (V/us) |
1.7@5V |
Typical Settling Time (ns) |
4000 |
Typical Input Noise Voltage Density (nV/rtHz) |
33@5V |
Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.025@5V |
Shut Down Support |
No |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Supplier Temperature Grade |
Extended |
Power Supply Type |
Single|Dual |
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PACKAGE INFO
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Supplier Package |
VSSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
3.1(Max) |
Package Width (mm) |
3.1(Max) |
Package Height (mm) |
0.95(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3.1(Max) |
Package Overall Width (mm) |
5.05(Max) |
Package Overall Height (mm) |
1.1(Max) |
Seated Plane Height (mm) |
1.1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Very Thin Shrink Small Outline Package |
Package Family Name |
SO |
Jedec |
MO-187 |
Package Outline |
Link to Datasheet |
Maximum PACKAGE_DIMENSION_H |
0.95 |
Minimum PACKAGE_DIMENSION_H |
N/A |
Maximum PACKAGE_DIMENSION_L |
3.1 |
Minimum PACKAGE_DIMENSION_L |
2.9 |
Maximum PACKAGE_DIMENSION_W |
3.1 |
Minimum PACKAGE_DIMENSION_W |
2.9 |
Maximum Diameter |
N/R |
Minimum Diameter |
N/R |
Maximum Seated_Plane_Height |
1.1 |
Minimum Seated_Plane_Height |
N/A |
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MANUFACTURING INFO
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MSL |
1 |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
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PACKAGING INFO
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ECAD MODELS |

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APPLICATIONS |
• Optimized for AEC-Q100 grade 1 applications
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• Infotainment and cluster
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• Passive safety
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• Body electronics and lighting
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• HEV/EV inverter and motor control
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• On-board (OBC) and wireless charger
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• Powertrain current sensor
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• Advanced driver assistance systems (ADAS)
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• Single-supply, low-side, unidirectional currentsensing circuit |
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