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• Qualified for Automotive Applications
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• AEC-Q100 Qualified With the Following Results:– LMV822-Q1 And LMV824-Q1 Are Available in Automotive AEC-Q100 Grade 1 Version
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• For Vs = 5 V, Typical Supply Values Unless Otherwise Noted
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• LMV824 Available With Extended Temperature Range to 125°C
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• Small SC70-5 Package 2.0 x 1.25 x 0.95 mm
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• Specified Performance At 2.5 V, 2.7 V and 5 V
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• VOS 3.5 mV (Max)
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• TCVOS 1 uV/°C
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• Gain Bandwidth Product At 2.7 V, 5 MHz
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• ISupply At 2.7 V Supply, 220 μA per Amplifier
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• Slew Rate 1.4 V/µs (Min)
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• CMRR 90 dB
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• PSRR 85 dB
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• VCM At 5 V Supply, -0.3 V to 4.3 V
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• Rail to Rail Output (RRO)– 600 Ω Load, 160 mV From Rail– 10 kΩ Load, 55 mV From Rail
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• Stable Performance with Capacitive Loads
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CATALOG |
LMV824MTX/NOPB COUNTRY OF ORIGIN
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LMV824MTX/NOPB PARAMETER INFORMATION
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LMV824MTX/NOPB PACKAGING INFORMATION
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LMV824MTX/NOPB MANUFACTURING INFORMATION
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LMV824MTX/NOPB TYPE OF PACKAGING
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LMV824MTX/NOPB ECAD MODELS |
LMV824MTX/NOPB APPLICATIONS
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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Malaysia
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PARAMETER INFORMATION
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Manufacturer Type |
Low Voltage Amplifier |
type |
Low Voltage Amplifier |
Rail to Rail |
Rail to Rail Output |
Minimum Single Supply Voltage (V) |
2.5 |
Number of Channels per Chip |
4 |
Minimum PSRR (dB) |
75 |
Typical Single Supply Voltage (V) |
2.7|5 |
Maximum Single Supply Voltage (V) |
5.5 |
Minimum Dual Supply Voltage (V) |
±1.25 |
Typical Gain Bandwidth Product (MHz) |
5.6 |
Maximum Input Offset Voltage (mV) |
3.5@5V |
Maximum Input Offset Current (uA) |
0.03@5V |
Maximum Dual Supply Voltage (V) |
±2.75 |
Maximum Operating Supply Voltage (V) |
±2.75|5.5 |
Maximum Input Bias Current (uA) |
0.1@5V |
Minimum CMRR (dB) |
72 |
Maximum Supply Voltage Range (V) |
5.5 to 6 |
Minimum CMRR Range (dB) |
71 to 75 |
Typical Voltage Gain (dB) |
105 |
Typical Slew Rate (V/us) |
2@5V |
Typical Input Offset Current (uA) |
0.0005@5V |
Minimum Slew Rate (V/us) |
1.4@5V |
Typical Output Current (mA) |
45@5V |
Typical Input Noise Voltage Density (nV/rtHz) |
24@5V |
Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.25@5V |
Typical Input Bias Current (uA) |
0.04@5V |
Shut Down Support |
no |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Power Supply Type |
Single|Dual |
Maximum Supply Current (mA) |
1.3@5V |
Input Offset Voltage Drift (uV/°C) |
1(Typ) |
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PACKAGING INFORMATION
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Supplier Packaging |
TSSOP |
Basic package types |
Lead-Frame SMT |
Number of Pins |
14 |
Pin shape |
Gull-wing |
PCB |
14 |
Ear piece |
N/R |
Pin spacing (mm) |
0.65 |
Package length (mm) |
5.1(Max) |
Package width (mm) |
4.5(Max) |
Package height (mm) |
1.05(Max) |
Package diameter (mm) |
N/R |
Package Overall Length (mm) |
5.1(Max) |
Package Overall Width (mm) |
6.6(Max) |
Package Overall Height (mm) |
1.2(Max) |
Mounting surface height (mm) |
1.2(Max) |
Install |
Surface Mount |
Package weight (g) |
not applicable |
Packaging materials |
Plastic |
package instruction |
Thin Shrink Small Outline Package |
Package Series Name |
SO |
JEDEC |
MO-153AB-1 |
Package Outline |
Link to data sheet |
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MANUFACTURING INFORMATION
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MSL |
1 |
Maximum reflow temperature (°C) |
260 |
Reflow time (seconds) |
30 |
Reflow cycles |
3 |
standard |
J-STD-020D |
Reflow temperature source |
Link to data sheet |
Maximum wave soldering temperature (°C) |
N/R |
Wave soldering time (seconds) |
N/R |
Lead Finish(Plating) |
Matte Sn|Au |
Plating materials |
N/A|Pd over Ni |
Terminal base material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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TYPE OF PACKAGING
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Packaging Suffix |
X |
Package |
Tape and Reel Packaging |
Packing quantity |
2500 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
12.4 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q1 |
Package Type File |
Link to data sheet |
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ECAD MODELS
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APPLICATIONS
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• Cordless Phones
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• Cellular Phones
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• Laptops
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• PDAs
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• PCMCIA
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