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• Qualified for Automotive Applications
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• Typical 1.8-V Supply Values; Unless Otherwise
Noted
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• Specified at 1.8 V, 2.7 V, and 5 V
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• VCM 200 mV Beyond Rails
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• Supply Current (per Channel) 100 μA
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• Gain Bandwidth Product 1.4 MHz
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• Maximum VOS 4 mV
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• Ultra Tiny Packages
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| CATALOG |
LMV931Q1MF/NOPB COUNTRY OF ORIGIN
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LMV931Q1MF/NOPB PARAMETRIC INFO
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LMV931Q1MF/NOPB PACKAGE INFO
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LMV931Q1MF/NOPB MANUFACTURING INFO
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LMV931Q1MF/NOPB PACKAGING INFO
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LMV931Q1MF/NOPB ECAD MODELS
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LMV931Q1MF/NOPB APPLICATIONS
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COUNTRY OF ORIGIN
|
Malaysia
|
|
PARAMETRIC INFO
|
| Manufacturer Type |
Low Power Amplifier |
| Type |
Low Power Amplifier |
| Rail to Rail |
Rail to Rail Input/Output |
| Number of Channels per Chip |
1 |
| Minimum Single Supply Voltage (V) |
1.8 |
| Minimum PSRR (dB) |
70 |
| Typical Single Supply Voltage (V) |
2.7|5 |
| Output Type |
CMOS |
| Maximum Single Supply Voltage (V) |
5.5 |
| Typical Gain Bandwidth Product (MHz) |
1.5 |
| Maximum Input Offset Voltage (mV) |
4@5V |
| Maximum Input Offset Current (uA) |
0.025@5V |
| Maximum Input Bias Current (uA) |
0.035@5V |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Supply Voltage Range (V) |
5.5 to 6 |
| Minimum CMRR (dB) |
50 |
| Minimum CMRR Range (dB) |
50 to 60 |
| Typical Voltage Gain (dB) |
113 |
| Typical Slew Rate (V/us) |
0.42@5V |
| Typical Input Noise Voltage Density (nV/rtHz) |
50@5V |
| Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.08@5V |
| Shut Down Support |
No |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Automotive |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single |
| Maximum Supply Current (mA) |
0.21@5V |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
1.1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.8 |
| Package Overall Height (mm) |
1.18 |
| Seated Plane Height (mm) |
1.18 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.4 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
1.3 |
| Minimum PACKAGE_DIMENSION_H |
0.9 |
| Maximum PACKAGE_DIMENSION_L |
3.05 |
| Minimum PACKAGE_DIMENSION_L |
2.75 |
| Maximum PACKAGE_DIMENSION_W |
1.75 |
| Minimum PACKAGE_DIMENSION_W |
1.45 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.45 |
| Minimum Seated_Plane_Height |
0.9 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.08 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.45 |
| Terminal Thickness (mm) |
0.15 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
|
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Engine Control Units (ECU) |
| • Body Control Modules (BCM) |
| • Battery Management Systems (BMS) |
| • Ultrasonic Ranging and LIDAR |
| • Occupant Detection |
| • Infotainment Systems |
| |
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