|
|
• Output frequency: 45 MHz to 22.6 GHz
|
• 36-fs rms jitter (12 kHz – 95 MHz) at 6 GHz
|
• 2.5-µs fast VCO calibration time
|
• Mute pin with 200-ns mute/unmute time
|
• –45-dBc VCO leakage with doubler enabled
|
|
| CATALOG |
LMX2820RTCT COUNTRY OF ORIGIN
|
LMX2820RTCT PARAMETRIC INFO
|
LMX2820RTCT PACKAGE INFO
|
LMX2820RTCT MANUFACTURING INFO
|
LMX2820RTCT PACKAGING INFO
|
LMX2820RTCT ECAD MODELS
|
LMX2820RTCT APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
Singapore
|
Philippines
|
|
PARAMETRIC INFO
|
| Number of Outputs per Chip |
3 |
| Clock Input Frequency (MHz) |
5 to 22600 |
| Maximum Output Frequency (MHz) |
22600 |
| Input Logic Level |
CMOS|Crystal |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Internal/External Clock Type |
VCO|XO |
| Output Supply Voltage |
3.15V to 3.45V |
| Input Signal Type |
Single-Ended|Differential |
| Output Signal Type |
Differential |
| Hitless Protection Switching |
No |
| Frequency Margining |
No |
| Programmability |
Yes |
| User Programming Method |
SPI |
| Number of PLL |
1 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Supply Voltage (V) |
3.15 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
3.45 |
| Number of Clock Inputs |
3 |
| Spread Spectrum |
No |
| Maximum Supply Current (mA) |
590(Typ) |
|
|
PACKAGE INFO
|
| Supplier Package |
VQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
48 |
| Lead Shape |
No Lead |
| PCB |
48 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
7.1(Max) |
| Package Width (mm) |
7.1(Max) |
| Package Height (mm) |
0.85(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
7.1(Max) |
| Package Overall Width (mm) |
7.1(Max) |
| Package Overall Height (mm) |
0.9(Max) |
| Seated Plane Height (mm) |
0.9(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
0.85 |
| Minimum PACKAGE_DIMENSION_H |
0.8 |
| Maximum PACKAGE_DIMENSION_L |
7.1 |
| Minimum PACKAGE_DIMENSION_L |
6.9 |
| Maximum PACKAGE_DIMENSION_W |
7.1 |
| Minimum PACKAGE_DIMENSION_W |
6.9 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
0.9 |
| Minimum Seated_Plane_Height |
0.8 |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
AuAg |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
250 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
 |
|
| APPLICATIONS |
| • Radar and electronic warfare |
| • 5G and mm-Wave wireless infrastructure |
| • Microwave backhaul |
| • Test and measurement equipment |
| • High-speed data converter clocking |
| |
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