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| CATALOG |
LMZ22008TZ/NOPB COUNTRY OF ORIGIN
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LMZ22008TZ/NOPB PARAMETRIC INFO
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LMZ22008TZ/NOPB PACKAGE INFO
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LMZ22008TZ/NOPB MANUFACTURING INFO
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LMZ22008TZ/NOPB PACKAGING INFO
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LMZ22008TZ/NOPB ECAD MODELS
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COUNTRY OF ORIGIN
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Malaysia
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PARAMETRIC INFO
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| Type |
Step Down |
| Number of Outputs |
1 |
| Output Voltage (V) |
0.8 to 6 |
| Maximum Output Power (W) |
40 |
| Maximum Output Current (A) |
8 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Switching Regulator |
Yes |
| Minimum Input Voltage (V) |
6 |
| Maximum Input Voltage (V) |
20 |
| Output Type |
Adjustable |
| Efficiency (%) |
89.5(Typ) |
| Load Regulation |
1mV(Typ) |
| Line Regulation |
0.2%(Typ) |
| Switching Frequency (kHz) |
600 |
| Typical Standby Current (mA) |
0.032 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| On/Off Logic |
Positive |
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PACKAGE INFO
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| Supplier Package |
TO-PMOD EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
11 |
| Lead Shape |
Gull-wing |
| PCB |
11 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
15 |
| Package Width (mm) |
15 |
| Package Height (mm) |
5.9 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
6.13(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
N/A |
| Package Family Name |
TO-PMOD |
| Jedec |
N/A |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
32 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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