LP38798SDE-ADJ/NOPB Texas Instruments IC REG LIN POS ADJ 800MA 12WSON

label:
2023/11/2 396


• Wide Operating Input Voltage Range: 3 V to 20 V
• Ultra-Low Output Noise: 5 µVRMS (10 Hz to 100 kHz)
• High PSRR: 90 dB at 10 kHz, 60 dB at 100 kHz
• ±1% Output Voltage Initial Accuracy (TJ = 25°C)
• Very Low Dropout: 200 mV (Typical) at 800 mA
• Stable with Ceramic or Tantalum Output Capacitors
• Excellent Line and Load Transient Response
• Current Limit and Overtemperature Protection
• Create a Custom Design Using the LP38798 With the WEBENCH® Power Designer


CATALOG
LP38798SDE-ADJ/NOPB COUNTRY OF ORIGIN
LP38798SDE-ADJ/NOPB PARAMETRIC INFO   
LP38798SDE-ADJ/NOPB PACKAGE INFO
LP38798SDE-ADJ/NOPB MANUFACTURING INFO
LP38798SDE-ADJ/NOPB PACKAGING INFO
LP38798SDE-ADJ/NOPB ECAD MODELS
LP38798SDE-ADJ/NOPB FUNCTIONAL BLOCK DIAGRAM
LP38798SDE-ADJ/NOPB APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Type LDO
Number of Outputs 1
Maximum Output Current (A) 0.8
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Output Type Adjustable
Output Voltage Range (V) <1.8|1.8 to 10|10 to 20
Regulation Condition Change In Load 790mA
Regulation Condition Change In Line 14.5V
Junction to Ambient 138°C/W
Junction to Case 5°C/W
Polarity Positive
Special Features Current Limit|Thermal Protection
Process Technology CMOS
Line Regulation 0.005%/V(Typ)
Maximum Quiescent Current (mA) 2.1
Maximum Dropout Voltage @ Current (V) 0.42@800mA
Minimum Input Voltage (V) 3
Maximum Input Voltage (V) 20
Output Voltage (V) 1.2 to 19.8
Typical Quiescent Current (mA) 1.4
Typical Dropout Voltage @ Current (V) 0.2@800mA
Reference Voltage (V) 1.212
Accuracy (%) ±1
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Typical Ground Current @ Full Load (mA) 1.6
Typical PSRR (dB) 110
Typical Output Capacitance (uF) 1
Typical Output Noise Voltage (uVrms) 11.58
Pass Element Type NMOS
Output Capacitor Type Ceramic|Tantalum
 
PACKAGE INFO
Supplier Package WSON EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 12
Lead Shape No Lead
PCB 12
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 4.1(Max)
Package Width (mm) 4.1(Max)
Package Height (mm) 0.75(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 4.1(Max)
Package Overall Width (mm) 4.1(Max)
Package Overall Height (mm) 0.8(Max)
Seated Plane Height (mm) 0.8(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Very Thin Small Outline No Lead Package, Exposed Pad
Package Family Name SON
Jedec N/A
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R
 
PACKAGING INFO
Packaging Suffix E
Packaging Tape and Reel
Quantity Of Packaging 250
Reel Diameter (in) 7
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet
 
ECAD MODELS


FUNCTIONAL BLOCK DIAGRAM


APPLICATIONS
• RF Power Supplies: PLLs, VCOs, Mixers, LNAs
• Telecom Infrastructure
• Wireless Infrastructure
• Very Low-Noise Instrumentation
• Precision Power Supplies
• High-Speed, High-Precision Data Converters


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