|
|
• Wide Operating Input Voltage Range:
3 V to 20 V |
• Ultra-Low Output Noise: 5 µVRMS
(10 Hz to 100 kHz) |
• High PSRR: 90 dB at 10 kHz, 60 dB at 100 kHz |
• ±1% Output Voltage Initial Accuracy (TJ = 25°C) |
• Very Low Dropout: 200 mV (Typical) at 800 mA |
• Stable with Ceramic or Tantalum Output
Capacitors |
• Excellent Line and Load Transient Response |
• Current Limit and Overtemperature Protection |
• Create a Custom Design Using the LP38798 With
the WEBENCH® Power Designer |
|
CATALOG |
LP38798SDE-ADJ/NOPB COUNTRY OF ORIGIN |
LP38798SDE-ADJ/NOPB PARAMETRIC INFO |
LP38798SDE-ADJ/NOPB PACKAGE INFO |
LP38798SDE-ADJ/NOPB MANUFACTURING INFO |
LP38798SDE-ADJ/NOPB PACKAGING INFO |
LP38798SDE-ADJ/NOPB ECAD MODELS |
LP38798SDE-ADJ/NOPB FUNCTIONAL BLOCK DIAGRAM |
LP38798SDE-ADJ/NOPB APPLICATIONS |
|
COUNTRY OF ORIGIN |
Malaysia |
|
PARAMETRIC INFO |
Type |
LDO |
Number of Outputs |
1 |
Maximum Output Current (A) |
0.8 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Output Type |
Adjustable |
Output Voltage Range (V) |
<1.8|1.8 to 10|10 to 20 |
Regulation Condition Change In Load |
790mA |
Regulation Condition Change In Line |
14.5V |
Junction to Ambient |
138°C/W |
Junction to Case |
5°C/W |
Polarity |
Positive |
Special Features |
Current Limit|Thermal Protection |
Process Technology |
CMOS |
Line Regulation |
0.005%/V(Typ) |
Maximum Quiescent Current (mA) |
2.1 |
Maximum Dropout Voltage @ Current (V) |
0.42@800mA |
Minimum Input Voltage (V) |
3 |
Maximum Input Voltage (V) |
20 |
Output Voltage (V) |
1.2 to 19.8 |
Typical Quiescent Current (mA) |
1.4 |
Typical Dropout Voltage @ Current (V) |
0.2@800mA |
Reference Voltage (V) |
1.212 |
Accuracy (%) |
±1 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Typical Ground Current @ Full Load (mA) |
1.6 |
Typical PSRR (dB) |
110 |
Typical Output Capacitance (uF) |
1 |
Typical Output Noise Voltage (uVrms) |
11.58 |
Pass Element Type |
NMOS |
Output Capacitor Type |
Ceramic|Tantalum |
|
|
PACKAGE INFO |
Supplier Package |
WSON EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
12 |
Lead Shape |
No Lead |
PCB |
12 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
4.1(Max) |
Package Width (mm) |
4.1(Max) |
Package Height (mm) |
0.75(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
4.1(Max) |
Package Overall Width (mm) |
4.1(Max) |
Package Overall Height (mm) |
0.8(Max) |
Seated Plane Height (mm) |
0.8(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Very Very Thin Small Outline No Lead Package, Exposed Pad |
Package Family Name |
SON |
Jedec |
N/A |
|
|
MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO |
Packaging Suffix |
E |
Packaging |
Tape and Reel |
Quantity Of Packaging |
250 |
Reel Diameter (in) |
7 |
Reel Width (mm) |
12.4 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS |
|
|
FUNCTIONAL BLOCK DIAGRAM |
|
|
APPLICATIONS |
• RF Power Supplies: PLLs, VCOs, Mixers, LNAs |
• Telecom Infrastructure |
• Wireless Infrastructure |
• Very Low-Noise Instrumentation |
• Precision Power Supplies |
• High-Speed, High-Precision Data Converters |
|