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• Adjustable VOUT Range of 0.80V to 1.8V
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• Wide VBIAS Supply Operating Range of 3.0V to 5.5V
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• Stable with 10µF Ceramic Capacitors
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• Dropout Voltage of 115 mV (Typical) at 800 mA Load Current
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• Over-Temperature and Over-Current Protection
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| CATALOG |
LP38851MRX-ADJ/NOPB PARAMETRIC INFO
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LP38851MRX-ADJ/NOPB PACKAGE INFO
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LP38851MRX-ADJ/NOPB MANUFACTURING INFO
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LP38851MRX-ADJ/NOPB PACKAGING INFO
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LP38851MRX-ADJ/NOPB ECAD MODELS
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LP38851MRX-ADJ/NOPB APPLICATIONS
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PARAMETRIC INFO
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| Type |
LDO |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
0.8 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Output Type |
Adjustable |
| Output Voltage Range (V) |
<1.8|1.8 to 10 |
| Junction to Ambient |
168°C/W(Typ) |
| Junction to Case |
11°C/W(Typ) |
| Polarity |
Positive |
| Special Features |
Current Limit|Thermal Shutdown Protection |
| Load Regulation |
0.2%/A(Typ) |
| Line Regulation |
0.04%/V(Typ) |
| Maximum Quiescent Current (mA) |
8.5 |
| Maximum Dropout Voltage @ Current (V) |
0.15@800mA |
| Minimum Input Voltage (V) |
0.915 |
| Maximum Input Voltage (V) |
5.5 |
| Output Voltage (V) |
0.8 to 1.8 |
| Typical Quiescent Current (mA) |
7 |
| Typical Dropout Voltage @ Current (V) |
0.115@800mA |
| Accuracy (%) |
±1.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Noise Spectral Density (uV/rtHz) |
1@120Hz |
| Typical PSRR (dB) |
72 |
| Typical Output Capacitance (uF) |
10 |
| Typical Output Noise Voltage (uVrms) |
150 |
| Output Capacitor Type |
Ceramic |
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|
PACKAGE INFO
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| Supplier Package |
HSOIC EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.55(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.7(Max) |
| Seated Plane Height (mm) |
1.7(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Family Name |
SO |
| Jedec |
MS-012-BA |
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|
MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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|
PACKAGING INFO
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| Packaging Suffix |
X |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• ASIC Power Supplies in: – Desktops, Notebooks, and Graphics Cards，Servers – Gaming Set Top Boxes, Printers and Copiers
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| • Server Core and I/O Supplies
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• DSP and FPGA Power Supplies
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| • SMPS Post-Regulator |
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