LP5912Q1.8DRVRQ1 Texas Instruments LP5912-Q1 Automotive 500-mA Low-Noise, Low-IQ LDO

label:
2025/04/10 36
LP5912Q1.8DRVRQ1 Texas Instruments LP5912-Q1 Automotive 500-mA Low-Noise, Low-IQ LDO


• Qualified for Automotive Applications
• Input Voltage Range: 1.6 V to 6.5 V
• Output Voltage Range: 0.8 V to 5.5 V
• Output Current up to 500 mA


CATALOG
LP5912Q1.8DRVRQ1 COUNTRY OF ORIGIN
LP5912Q1.8DRVRQ1 PARAMETRIC INFO
LP5912Q1.8DRVRQ1 PACKAGE INFO
LP5912Q1.8DRVRQ1 MANUFACTURING INFO
LP5912Q1.8DRVRQ1 PACKAGING INFO
LP5912Q1.8DRVRQ1 ECAD MODELS
LP5912Q1.8DRVRQ1 APPLICATIONS


COUNTRY OF ORIGIN
China
Philippines


PARAMETRIC INFO
Type LDO
Number of Outputs 1
Maximum Output Current (A) 0.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Output Type Fixed
Output Voltage Range (V) 1.8 to 10
Junction to Ambient 71.2°C/W
Junction to Case 93.7°C/W
Polarity Positive
Special Features Short Circuit Protection|Thermal Overload Protection
Load Regulation 0.0022%/mA(Typ)
Line Regulation 0.8%/V(Typ)
Maximum Quiescent Current (mA) 0.055
Maximum Dropout Voltage @ Current (V) 0.25@500mA
Minimum Input Voltage (V) 1.6
Maximum Input Voltage (V) 6.5
Output Voltage (V) 1.8
Typical Quiescent Current (mA) 0.03
Typical Dropout Voltage @ Current (V) 0.17@500mA
Accuracy (%) ±2
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Typical Ground Current @ Full Load (mA) 0.035
Typical PSRR (dB) 80
Typical Output Capacitance (uF) 1
Typical Output Noise Voltage (uVrms) 12
Output Capacitor Type Ceramic


PACKAGE INFO
Supplier Package WSON EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 6
Lead Shape No Lead
PCB 6
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 2.1(Max)
Package Width (mm) 2.1(Max)
Package Height (mm) 0.75(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 2.1(Max)
Package Overall Width (mm) 2.1(Max)
Package Overall Height (mm) 0.8(Max)
Seated Plane Height (mm) 0.8(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Very Thin Small Outline No Lead Package, Exposed Pad
Package Family Name SON
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7.09
Reel Width (mm) 8.4
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q2
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• Automotive Infotainment
• Telematics Systems
• ADAS Cameras and Radar
• Navigation Systems
Продукт RFQ