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• 260 to 1260 hPa absolute pressure range
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• Current consumption down to 3 μA
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• High overpressure capability: 20x full-scale
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| • Embedded temperature compensation
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| • 24-bit pressure data output |
| • 16-bit temperature data output |
| • ODR from 1 Hz to 75 Hz |
| • SPI and I²C interfaces |
| • Embedded FIFO |
| • Interrupt functions: Data Ready, FIFO flags,pressure thresholds |
| • Supply voltage: 1.7 to 3.6 V |
| • High shock survivability: 22,000 g |
| • Small and thin package |
| • ECOPACK® lead-free compliant |
|
| CATALOG |
| LPS22HBTR COUNTRY OF ORIGIN |
LPS22HBTR PARAMETRIC INFO
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LPS22HBTR PACKAGE INFO
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LPS22HBTR MANUFACTURING INFO
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LPS22HBTR PACKAGING INFO
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LPS22HBTR EACD MODELS
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| LPS22HBTR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malta |
|
PARAMETRIC INFO
|
| Device Pressure Type |
Absolute |
| Equivalent Overload Pressure Range (psi) |
100 to 500 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Overload Pressure |
2000kPa |
| Maximum Storage Temperature (°C) |
125 |
| Maximum Supply Current (mA) |
0.015 |
| Minimum Operating Supply Voltage (V) |
1.7 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Storage Temperature (°C) |
-40 |
| Operating Pressure Range |
26kPa to 126kPa |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3 |
| Operating Supply Voltage (V) |
1.8|2.5|3.3 |
|
|
PACKAGE INFO
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| Supplier packaging |
HLGA |
| Basic package type |
Non-Lead-Frame SMT |
| Number of pins |
10 |
| Pin shape |
No Lead |
| PCB |
10 |
| ears |
N/R |
| Pin spacing (mm) |
0.5 |
| Package length (mm) |
2 |
| Package width (mm) |
2 |
| Package height (mm) |
not applicable |
| Package diameter (mm) |
N/R |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Package series name |
LGA |
| Package outline |
Link to datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum reflow temperature (°C) |
260 |
| Number of reflow cycles |
3 |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
Au |
| Plating materials |
Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Package |
Tape and reel packaging |
| Packing quantity |
1000 |
| packaging type file |
Link to datasheet |
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|
ECAD MODELS
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| APPLICATIONS |
| • Altimeters and barometers for portable devices |
| • GPS applications |
| • Weather station equipment |
| • Sport watches |
| |
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