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| |
| CATALOG |
| LQG15HS82NJ02D Country of Origin |
| LQG15HS82NJ02D Parametric Info |
| LQG15HS82NJ02D Package Info |
| LQG15HS82NJ02D Manufacturing Info |
| LQG15HS82NJ02D Packaging Info |
| |
| Country of Origin |
| Japan |
| |
| Parametric Info |
| Type |
RF Chip |
| Technology |
Multi-Layer |
| Protection Style |
Unshielded |
| Core Material |
Air |
| Inductance (H) |
0.082u |
| Tolerance |
5% |
| Inductance Test Frequency (Hz) |
100M |
| Maximum DC Current (A) |
0.2 |
| Maximum DC Resistance (Ohm) |
1.2 |
| Minimum Quality Factor |
8 |
| Quality Test Frequency (Hz) |
100M |
| Minimum Self Resonant Frequency (Hz) |
700M |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Operating Temperature (°C) |
-55 |
| Operating Temperature (°C) |
-55 to 125 |
|
| Package Info |
| Case Size |
0402 |
| Product Length (mm) |
1.05 |
| Product Depth (mm) |
0.55 |
| Product Height (mm) |
0.55 |
| Product Diameter (mm) |
N/R |
| Number of Terminals |
2 |
| Product Weight (g) |
0.001 |
|
| Manufacturing Info |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
2 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ni |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
|
| Packaging Info |
| Packaging Suffix |
D |
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Paper |
|
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