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CATALOG |
LQM21FN220N00L COUNTRY OF ORIGIN |
LQM21FN220N00L LIFE CYCLE |
LQM21FN220N00L PARAMETRIC INFO
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LQM21FN220N00L PACKAGE INFO
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LQM21FN220N00L MANUFACTURING INFO
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LQM21FN220N00L PACKAGING INFO
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COUNTRY OF ORIGIN |
Japan |
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LIFE CYCLE |
LTB Mar 31, 2025 |
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PARAMETRIC INFO
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type |
Power Chip |
Technology |
Multi-Layer |
Protection Style |
Shielded |
Core Material |
Ferrite |
Inductance(H) |
22u |
Tolerance |
30% |
Inductance Test Frequency (Hz) |
1M |
Maximum DC Current (A) |
0.013 |
Maximum Saturation Current (A) |
0.013 |
Maximum DC Resistance (Ohm) |
0.455 |
Minimum Self Resonant Frequency (Hz) |
15M |
Maximum Operating Temperature (°C) |
85 |
Minimum Operating Temperature (°C) |
-40 |
Operating Temperature (°C) |
-40 to 85 |
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PACKAGE INFO
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Case Size |
0805 |
Product Length (mm) |
2.2 |
Product Depth (mm) |
1.45 |
Product Height (mm) |
1.45 |
Product Diameter (mm) |
N/R |
Number of Terminals |
2 |
Product Weight (g) |
0.016 |
Install |
Surface Mount |
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MANUFACTURING INFO
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MSL |
1 |
Maximum reflow temperature (°C) |
260 |
Reflow soldering time (seconds) |
10 |
Number of reflow cycles |
2 |
Reflow temperature source |
Link to datasheet |
Maximum wave soldering temperature (°C) |
265 |
Wave soldering time (seconds) |
5 |
Wave soldering temperature source |
Link to datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Plating materials |
Ni |
Terminal Base Material |
not applicable |
Number of Wave Cycles |
2 |
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PACKAGING INFO
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Packaging Suffix |
L |
Package |
Tape and reel packaging |
packaging type file |
Link to datasheet |
Tape Type |
Embossed |
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