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| CATALOG |
LQM21PN4R7MGRD COUNTRY OF ORIGIN
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LQM21PN4R7MGRD PARAMETRIC INFO
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LQM21PN4R7MGRD PACKAGE INFO
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LQM21PN4R7MGRD MANUFACTURING INFO
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LQM21PN4R7MGRD PACKAGING INFO
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COUNTRY OF ORIGIN
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Japan
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PARAMETRIC INFO
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| Type |
Power Chip |
| Technology |
Multi-Layer |
| Protection Style |
Shielded |
| Core Material |
Ferrite |
| Inductance (H) |
4.7u |
| Tolerance |
20% |
| Inductance Test Frequency (Hz) |
1M |
| Maximum DC Current (A) |
0.8 |
| Maximum DC Resistance (Ohm) |
0.288 |
| Minimum Self Resonant Frequency (Hz) |
30M |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Operating Temperature (°C) |
-55 |
| Operating Temperature (°C) |
-55 to 125 |
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PACKAGE INFO
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| Case Size |
0805 |
| Maximum Product Length (mm) |
2.15 |
| Maximum Product Depth (mm) |
1.4 |
| Maximum Product Height (mm) |
1 |
| Maximum Product Diameter (mm) |
N/R |
| Number of Terminals |
2 |
| Product Weight (g) |
0.012 |
| Terminal Pitch (mm) |
N/R |
| Mounting |
Surface Mount |
| Product Diameter (mm) |
N/R |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
2 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
265 |
| Wave Solder Time (Sec) |
5 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
2 |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Paper |
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