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CATALOG |
LQW18AN56NJ00D COUNTRY OF ORIGIN |
LQW18AN56NJ00D PARAMETRIC INFO
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LQW18AN56NJ00D PACKAGE INFO
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LQW18AN56NJ00D MANUFACTURING INFO
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LQW18AN56NJ00D PACKAGING INFO
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COUNTRY OF ORIGIN |
Japan |
Malaysia |
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PARAMETRIC INFO
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Type |
RF Chip |
Technology |
Wirewound |
Protection Style |
Unshielded |
Core Material |
Non Magnetic |
Inductance (H) |
0.056u |
Tolerance |
5% |
Inductance Test Frequency (Hz) |
100M |
Maximum DC Current (A) |
0.36 |
Maximum DC Resistance (Ohm) |
0.35 |
Minimum Quality Factor |
38 |
Quality Test Frequency (Hz) |
200M |
Minimum Self Resonant Frequency (Hz) |
2400M |
Maximum Operating Temperature (°C) |
125 |
Minimum Operating Temperature (°C) |
-55 |
Operating Temperature (°C) |
-55 to 125 |
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PACKAGE INFO
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Case Size |
0603 |
Maximum Product Length (mm) |
1.8 |
Maximum Product Depth (mm) |
1 |
Maximum Product Height (mm) |
1 |
Maximum Product Diameter (mm) |
N/R |
Number of Terminals |
2 |
Product Weight (g) |
0.003 |
Mounting |
Surface Mount |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
10 |
Number of Reflow Cycle |
2 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
Ni |
Terminal Base Material |
N/A |
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PACKAGING INFO
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Packaging Suffix |
D |
Packaging |
Tape and Reel |
Quantity Of Packaging |
4000 |
Reel Diameter (in) |
7.09 |
Packaging Document |
Link to Datasheet |
Tape Material |
Paper |
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