
|
|
• “Always-on” experience with low power consumption for both accelerometer and gyroscope
|
• Power consumption: 0.4 mA in combo normal mode
and 0.65 mA in combo high-performance mode
|
• Smart FIFO up to 4 kbyte based on features set
|
• Android M compliant
|
• Auxiliary SPI for OIS data output for gyroscope and
accelerometer
|
• Hard, soft ironing for external magnetic sensor
corrections
|
• ±2/±4/±8/±16 g full scale
|
|
| CATALOG |
| LSM6DSMTR COUNTRY OF ORIGIN |
LSM6DSMTR PARAMETRIC INFO
|
LSM6DSMTR PACKAGE INFO
|
LSM6DSMTR MANUFACTURING INFO
|
LSM6DSMTR PACKAGING INFO
|
LSM6DSMTR ECAD MODELS
|
LSM6DSMTR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| China |
France
|
Italy
|
Philippines
|
Taiwan (Province of China)
|
Thailand
|
|
PARAMETRIC INFO
|
| Combined Sensors |
Accelerometer/Gyroscope |
| Axis Type |
6-Axis |
| Minimum Operating Supply Voltage (V) |
1.71 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Module/IC Classification |
IC |
| Accelerometer Range (g) |
±2|±4|±8|±16 |
| Gyroscope Range (°/sec) |
±125|±250|±500|±1000|±2000 |
| Interface Type |
I2C/SPI |
|
|
PACKAGE INFO
|
| Supplier Package |
LGA |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
14 |
| Lead Shape |
No Lead |
| PCB |
14 |
| Tab |
N/R |
| Package Length (mm) |
3 |
| Package Width (mm) |
2.5 |
| Package Height (mm) |
0.86 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Land Grid Array Package |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Reel Diameter (in) |
13(Max) |
| Reel Width (mm) |
12.4 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|

|
|
APPLICATIONS
|
• Motion tracking and gesture detection
|
• Sensor hub
|
• Indoor navigation
|
• IoT and connected devices
|
• Smart power saving for handheld devices
|
• EIS and OIS for camera applications
|
• Vibration monitoring and compensation
|
| |