LT1357CS8 Analog Devices IC VOLTAGE FEEDBACK 1 CIRC 8SO

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2024/09/19 165
LT1357CS8 Analog Devices 	IC VOLTAGE FEEDBACK 1 CIRC 8SO


• 25MHz Gain Bandwidth
• 600V/µs Slew Rate
• 2.5mA Maximum Supply Current
• Unity-Gain Stable
• C-LoadTM Op Amp Drives All Capacitive Loads
• 8nV/√Hz Input Noise Voltage
• 600µV Maximum Input Offset Voltage
• 500nA Maximum Input Bias Current
• 120nA Maximum Input Offset Current


CATALOG
LT1357CS8 COUNTRY OF ORIGIN
LT1357CS8 PARAMETRIC INFO
LT1357CS8 PACKAGE INFO
LT1357CS8 MANUFACTURING INFO
LT1357CS8 ECAD MODELS
LT1357CS8 APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Manufacturer Type High Speed Amplifier
Type High Speed Amplifier
Number of Channels per Chip 1
Process Technology Bipolar
Minimum PSRR (dB) 92
Typical Gain Bandwidth Product (MHz) 22
Minimum Dual Supply Voltage (V) ±2.5
Maximum Input Offset Voltage (mV) 0.6@±5V
Typical Dual Supply Voltage (V) ±3|±5|±9|±12|±15
Maximum Dual Supply Voltage (V) ±18
Maximum Input Offset Current (uA) 0.12@±15V
Maximum Input Bias Current (uA) 0.5@±15V
Maximum Operating Supply Voltage (V) ±18
Maximum Supply Voltage Range (V) 36 to 37
Minimum CMRR (dB) 78
Minimum CMRR Range (dB) 75 to 80
Typical Voltage Gain (dB) 93.06
Typical Slew Rate (V/us) 220@±5V
Typical Settling Time (ns) 380
Typical Output Current (mA) 25@±5V
Typical Input Noise Voltage Density (nV/rtHz) 8@±15V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.8@±15V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Power Supply Type Dual
Maximum Supply Current (mA) 2.4@±5V
Maximum Power Dissipation (mW) 387


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.99(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 235
Reflow Solder Time (Sec) 20
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 235
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnPb
Under Plating Material Ag
Terminal Base Material Alloy 42
Number of Wave Cycles N/A


ECAD MODELS



APPLICATIONS
• Wideband Amplifiers
• Buffers
• Active Filters
• Data Acquisition Systems
• Photodiode Amplifiers

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