LT1763CS8-3.3#TRPBF Analog Devices IC REG LINEAR 3.3V 500MA 8SOIC

label:
2024/09/14 156
LT1763CS8-3.3#TRPBF Analog Devices  IC REG LINEAR 3.3V 500MA 8SOIC


• Low Noise: 20µVRMS (10Hz to 100kHz)
• Output Current: 500mA
• Low Quiescent Current: 30µA
• Wide Input Voltage Range: 1.8V to 20V
• Low Dropout Voltage: 300mV
• Very Low Shutdown Current: < 1µA
• No Protection Diodes Needed
• Fixed Output Voltages: 1.5V, 1.8V, 2.5V, 3V, 3.3V, 5V
• Adjustable Output from 1.22V to 20V


CATALOG
LT1763CS8-3.3#TRPBF COUNTRY OF ORIGIN
LT1763CS8-3.3#TRPBF PARAMETRIC INFO
LT1763CS8-3.3#TRPBF PACKAGE INFO
LT1763CS8-3.3#TRPBF MANUFACTURING INFO
LT1763CS8-3.3#TRPBF PACKAGING INFO
LT1763CS8-3.3#TRPBF ECAD MODELS
LT1763CS8-3.3#TRPBF APPLICATIONS


COUNTRY OF ORIGIN
Thailand
Malaysia
Taiwan (Province of China)
Philippines


PARAMETRIC INFO
Type LDO
Number of Outputs 1
Maximum Output Current (A) 0.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Output Type Fixed
Output Voltage Range (V) 1.8 to 10
Regulation Condition Change In Load 499mA
Regulation Condition Change In Line 16.2V
Junction to Ambient 70°C/W
Junction to Case 35°C/W
Polarity Positive
Special Features Current Limit|Reverse Battery Protection|Reverse Current Protection|Shutdown|Thermal Protection
Load Regulation 17mV
Line Regulation 5mV
Maximum Dropout Voltage @ Current (V) 0.19@10mA|0.22@50mA|0.24@100mA|0.35@500mA
Minimum Input Voltage (V) 1.8
Maximum Input Voltage (V) 20
Output Voltage (V) 3.3
Typical Quiescent Current (mA) 0.03
Typical Dropout Voltage @ Current (V) 0.13@10mA|0.17@50mA|0.2@100mA|0.3@500mA
Accuracy (%) ±1.5(Typ)
Supplier Temperature Grade Commercial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Typical Ground Current @ Full Load (mA) 11
Typical PSRR (dB) 65
Typical Output Capacitance (uF) 3.3
Typical Output Noise Voltage (uVrms) 20
Output Capacitor Type Ceramic|Tantalum|Aluminum


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.99(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy
Number of Wave Cycles 2

PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Type Embossed

ECAD MODELS
APPLICATIONS
• Cellular Phones
• Battery-Powered Systems
• Noise-Sensitive Instrumentation Systems
Продукт RFQ