
|
|
• Protected from Overvoltage Line Faults to ±60V
|
• Pin Compatible with LTC485 and LTC491
|
• High Input Impedance Supports Up to 128 Nodes
|
• Controlled Slew Rates for EMI Emissions Control
|
|
| CATALOG |
LT1785ACS8#TRPBF COUNTRY OF ORIGIN
|
LT1785ACS8#TRPBF PARAMETRIC INFO
|
LT1785ACS8#TRPBF PACKAGE INFO
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LT1785ACS8#TRPBF MANUFACTURING INFO
|
LT1785ACS8#TRPBF PACKAGING INFO
|
LT1785ACS8#TRPBF ECAD MODELS
|
LT1785ACS8#TRPBF APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Thailand
|
Malaysia
|
|
PARAMETRIC INFO
|
| Function |
Line Transceiver |
| Number of Transceivers |
1 |
| Number of Transmitters |
1 |
| Number of Receivers |
1 |
| Data Transmission Topology |
Multidrop|Multipoint |
| Transmitter Signal Type |
Differential |
| Receiver Signal Type |
Differential |
| Transmitter Communication Type |
RS-422|RS-485 |
| Input Logic Level |
TTL |
| Output Logic Level |
TTL |
| Receiver Communication Type |
RS-422|RS-485 |
| Charge Pump |
No |
| External Capacitor Capacitance (uF) |
0.1 |
| Power Down Mode |
Shutdown |
| Channel Operating Mode |
Full Duplex|Half Duplex |
| Fail Safe |
Open/Short |
| Interface Standards |
RS-422|RS-485 |
| Number of Transmitter Enables |
1 |
| Number of Receiver Enables |
1 |
| Number of Drivers per Line |
1 |
| Number of Receivers per Line |
1 |
| Data Rate |
250Kbps(Min) |
| Driving Mode |
3-State |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
70 |
| Supplier Temperature Grade |
Commercial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Single |
| Typical Single Supply Voltage (V) |
5 |
| Minimum Single Supply Voltage (V) |
4.75 |
| Maximum Single Supply Voltage (V) |
5.25 |
| Maximum Supply Current (mA) |
9 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.99(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.48(Max) |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
|
|
| APPLICATIONS |
| • Industrial Control Data Networks |
| • CAN Bus Applications |
| • HVAC Controls |
| |