LT1785ACS8#TRPBF Analog Devices IC TXRX 60V RS485/RS422 8SOIC

label:
2025/08/8 6
LT1785ACS8#TRPBF Analog Devices IC TXRX 60V RS485/RS422 8SOIC


• Protected from Overvoltage Line Faults to ±60V
• Pin Compatible with LTC485 and LTC491
• High Input Impedance Supports Up to 128 Nodes
• Controlled Slew Rates for EMI Emissions Control


CATALOG
LT1785ACS8#TRPBF COUNTRY OF ORIGIN
LT1785ACS8#TRPBF PARAMETRIC INFO
LT1785ACS8#TRPBF PACKAGE INFO
LT1785ACS8#TRPBF MANUFACTURING INFO
LT1785ACS8#TRPBF PACKAGING INFO
LT1785ACS8#TRPBF ECAD MODELS
LT1785ACS8#TRPBF APPLICATIONS


COUNTRY OF ORIGIN
Thailand
Malaysia


PARAMETRIC INFO
Function Line Transceiver
Number of Transceivers 1
Number of Transmitters 1
Number of Receivers 1
Data Transmission Topology Multidrop|Multipoint
Transmitter Signal Type Differential
Receiver Signal Type Differential
Transmitter Communication Type RS-422|RS-485
Input Logic Level TTL
Output Logic Level TTL
Receiver Communication Type RS-422|RS-485
Charge Pump No
External Capacitor Capacitance (uF) 0.1
Power Down Mode Shutdown
Channel Operating Mode Full Duplex|Half Duplex
Fail Safe Open/Short
Interface Standards RS-422|RS-485
Number of Transmitter Enables 1
Number of Receiver Enables 1
Number of Drivers per Line 1
Number of Receivers per Line 1
Data Rate 250Kbps(Min)
Driving Mode 3-State
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Supplier Temperature Grade Commercial
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
Power Supply Type Single
Typical Single Supply Voltage (V) 5
Minimum Single Supply Voltage (V) 4.75
Maximum Single Supply Voltage (V) 5.25
Maximum Supply Current (mA) 9


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.99(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Terminal Width (mm) 0.48(Max)
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Q1
Packaging Document Link to Datasheet
 
ECAD MODELS


APPLICATIONS
• Industrial Control Data Networks
• CAN Bus Applications
• HVAC Controls  
Продукт RFQ