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• Wide Input Voltage Range: 2.9V to 40V
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• Positive or Negative Output Voltage Programming with a Single Feedback Pin
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• Current Mode Control Provides Excellent Transient Response
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• Programmable Operating Frequency (100kHz to 1MHz) with One External Resistor
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• Synchronizable to an External Clock |
• Low Shutdown Current < 1µA |
• Internal 7.2V Low Dropout Voltage Regulator |
• Programmable Input Undervoltage Lockout with Hysteresis |
• Programmable Soft-Start |
• Small 10-Lead DFN (3mm × 3mm) and Thermally Enhanced 10-Pin MSOP Packages |
• AEC-Q100 Qualified for Automotive Applications |
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CATALOG |
LT3757EMSE#TRPBF COUNTRY OF ORIGIN |
LT3757EMSE#TRPBF PARAMETRIC INFO
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LT3757EMSE#TRPBF PACKAGE INFO
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LT3757EMSE#TRPBF MANUFACTURING INFO
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LT3757EMSE#TRPBF PACKAGING INFO
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LT3757EMSE#TRPBF EACD MODELS
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LT3757EMSE#TRPBF APPLICATIONS |
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COUNTRY OF ORIGIN |
Thailand |
Malaysia |
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PARAMETRIC INFO
|
Topology |
Flyback|Inverting|Step Up|SEPIC |
Number of Outputs |
1 |
Maximum Switching Frequency (kHz) |
1000 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Maximum Input Voltage (V) |
40 |
Minimum Input Voltage (V) |
2.9 |
Synchronous Rectifier |
no |
Operating Supply Voltage (V) |
2.9 to 40 |
Synchronous Clock |
yes |
Maximum Supply Current (mA) |
2.2 |
Minimum Switching Frequency (kHz) |
100 |
Typical Switching Frequency (kHz) |
1000 |
Programmability |
yes |
Control Method |
PWM |
Supplier Temperature Rating |
Extended |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
|
Supplier packaging |
MSOP EP |
Basic package type |
Lead-Frame SMT |
Number of pins |
10 |
Pin shape |
Gull-wing |
PCB |
10 |
ears |
N/R |
Pin spacing (mm) |
0.5 |
Package length (mm) |
3 |
Package width (mm) |
3 |
Package height (mm) |
0.86 |
Package diameter (mm) |
N/R |
Package Overall Length (mm) |
3 |
Package Overall Width (mm) |
4.9 |
Package Overall Height (mm) |
1.1(Max) |
Mounting surface height (mm) |
1.1(Max) |
Install |
Surface Mount |
Package weight (g) |
not applicable |
Packaging materials |
Plastic |
package instruction |
Micro Small Outline Package, Exposed Pad |
Package series name |
SO |
JEDEC |
MO-187BA-T |
Package outline |
Link to datasheet |
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MANUFACTURING INFO
|
MSL |
1 |
Maximum reflow temperature (°C) |
260 |
Reflow soldering time (seconds) |
30 |
Number of reflow cycles |
3 |
standard |
J-STD-020D |
Reflow temperature source |
Link to datasheet |
Maximum wave soldering temperature (°C) |
260 |
Wave soldering time (seconds) |
10 |
Wave soldering temperature source |
Link to datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Plating materials |
Ag |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
2 |
|
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PACKAGING INFO
|
Packaging Suffix |
TR |
Package |
Tape and reel packaging |
Packing quantity |
2500 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
12.4 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Feed Hole Pitch (mm) |
4 |
Hole Center to Component Center (mm) |
2 |
Component Orientation |
Q1 |
packaging type file |
Link to datasheet |
Tape Type |
Embossed |
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ECAD MODELS
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APPLICATIONS |
• Automotive and Industrial Boost, Flyback, SEPIC and Inverting Converters |
• Telecom Power Supplies |
• Portable Electronic Equipment |
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