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• Silent Switcher® Architecture
n Ultralow EMI Emissions
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• High Efficiency at High Frequency
n Up to 96% Efficiency at 1MHz, 12VIN to 5VOUT
n Up to 94% Efficiency at 2MHz, 12VIN to 5VOUT
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• Wide Input Voltage Range: 3.4V to 42V
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• Ultralow Quiescent Current Burst Mode® Operation:
n 2.5μA IQ Regulating 12VIN to 3.3VOUT
n Output Ripple < 10mVP-P
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• Fast Minimum Switch On-Time: 30ns
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| • Low Dropout Under All Conditions: 125mV at 1A
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| • Safely Tolerates Inductor Saturation in Overload |
| • Adjustable and Synchronizable: 200kHz to 3MHz |
| • Peak Current Mode Operation |
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| CATALOG |
LT8614IUDC#TRPBF PARAMETRIC INFO
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LT8614IUDC#TRPBF PACKAGE INFO
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LT8614IUDC#TRPBF MANUFACTURING INFO
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LT8614IUDC#TRPBF PACKAGING INFO
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LT8614IUDC#TRPBF ECAD MODELS
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LT8614IUDC#TRPBF APPLICATIONS
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PARAMETRIC INFO
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| Type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
3.4 |
| Maximum Input Voltage (V) |
42 |
| Maximum Output Current (A) |
4 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Industrial |
| Switching Frequency (kHz) |
200 to 3000 |
| Efficiency (%) |
96 |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
3.4 to 42 |
| Output Type |
Adjustable |
| Line Regulation |
0.02%/V |
| Typical Quiescent Current (uA) |
2.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Switch Current (A) |
8.5 |
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PACKAGE INFO
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| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
18 |
| Lead Shape |
No Lead |
| PCB |
18 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.75(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
3 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
N/A |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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ECAD MODELS
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APPLICATIONS
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• Automotive and Industrial Supplies
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| • General Purpose Step-Down
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• GSM Power Supplies
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