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• Ultrawide Input Voltage Range: 3V to 100V
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• Output Voltage Range: 0.8V to 60V
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• Internal Synchronous Switches
|
| • Low Ripple Burst Mode® Operation: 16µA IQ at 12VIN to 5VOUT Output Ripple <10mVP-P 7µA IQ at 48VIN to 5VOUT Output Ripple <10mVP-P |
| • Low Dropout: 99% Maximum Duty Cycle |
| • Peak Current Mode Control |
| • Fixed Frequency Operation: 100kHz to 1MHz |
|
| CATALOG |
| LT8631IFE#TRPBF COUNTRY OF ORIGIN |
LT8631IFE#TRPBF PARAMETRIC INFO
|
LT8631IFE#TRPBF PACKAGE INFO
|
LT8631IFE#TRPBF MANUFACTURING INFO
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LT8631IFE#TRPBF PACKAGING INFO
|
LT8631IFE#TRPBF EACD MODELS
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| LT8631IFE#TRPBF APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
|
PARAMETRIC INFO
|
| Type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
3 |
| Maximum Input Voltage (V) |
100 |
| Output Voltage (V) |
0.8 to 60 |
| Maximum Output Current (A) |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Industrial |
| Switching Frequency (kHz) |
100 to 1000 |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
3 to 100 |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
16 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
6.6(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package, Exposed Pad |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
2 |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
|
ECAD MODELS
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| APPLICATIONS |
| • Telecom Supplies |
| • Distributed Supply Regulation |
| |
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