LT8641EUDC#PBF Analog Devices IC REG BUCK ADJ 3.5A SYNC 18QFN

label:
2023/12/28 243



• Silent Switcher® Architecture n Ultralow EMI Emissions n Spread Spectrum Frequency Modulation
• High Efficiency at High Frequency n Up to 95% Efficiency at 1MHz, 12VIN to 5VOUT n Up to 94% Efficiency at 2MHz, 12VIN to 5VOUT
• Wide Input Voltage Range: 3V to 65V
• 3.5A Maximum Continuous Output, 5A Peak Transient Output
• Ultralow Quiescent Current Burst Mode® Operation n 2.5μA IQ Regulating 12VIN to 3.3VOUT n Output Ripple < 10mVP-P
• Fast Minimum Switch On-Time: 35ns
• Low Dropout Under All Conditions: 130mV at 1A
• Safely Tolerates Inductor Saturation in Overload
• Adjustable and Synchronizable: 200kHz to 3MHz
• Peak Current Mode Operation
• Output Soft-Start and Tracking


CATALOG
LT8641EUDC#PBF COUNTRY OF ORIGIN
LT8641EUDC#PBF PARAMETRIC INFO
LT8641EUDC#PBF PACKAGE INFO
LT8641EUDC#PBF MANUFACTURING INFO
LT8641EUDC#PBF PACKAGING INFO
LT8641EUDC#PBF ECAD MODELS
LT8641EUDC#PBF APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Type Synchronous Step Down
Number of Outputs 1
Minimum Input Voltage (V) 3
Maximum Input Voltage (V) 65
Output Voltage (V) 0.81 to 64
Maximum Output Current (A) 3.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended
Switching Frequency (kHz) 200 to 3000
Efficiency (%) 95
Switching Regulator Yes
Operating Supply Voltage (V) 3 to 65
Output Type Adjustable
Line Regulation 0.03%/V
Typical Quiescent Current (uA) 300
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Typical Switch Current (A) 8.2


PACKAGE INFO
Supplier Package QFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 18
Lead Shape No Lead
PCB 18
Tab N/R
Package Length (mm) 4
Package Width (mm) 3
Package Height (mm) 0.75(Max)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Weight (g) N/A
Package Description Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 91


ECAD MODELS


 
APPLICATIONS
• Automotive and Industrial Supplies
• General Purpose Step-Down
• GSM Power Supplies

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