LTC1261LIMS8-4.5#PBF Analog Devices IC REG SWTCHD CAP INV 20MA 8MSOP

label:
2024/01/25 352



• Regulated Negative Voltage from a Single Positive Supply
• REG Pin Indicates Output is in Regulation
• Adjustable or Fixed Output Voltages
• Output Regulation: ±4.5%
• Supply Current: 650µA Typ
• Shutdown Mode Drops Supply Current to 5µA
• Up to 20mA Output Current
• Requires Only Three or Four External Capacitors
• Available in MS8 and SO-8 Packages


CATALOG
LTC1261LIMS8-4.5#PBF COUNTRY OF ORIGIN
LTC1261LIMS8-4.5#PBF PARAMETRIC INFO
LTC1261LIMS8-4.5#PBF PACKAGE INFO
LTC1261LIMS8-4.5#PBF MANUFACTURING INFO
LTC1261LIMS8-4.5#PBF PACKAGING INFO
LTC1261LIMS8-4.5#PBF ECAD MODELS
LTC1261LIMS8-4.5#PBF APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Function Inverting
Minimum Operating Supply Voltage (V) 4.75
Maximum Operating Supply Voltage (V) 5.25
Output Voltage (V) -4.5
Maximum Supply Current (mA) 1.5
Output Type Fixed
Output Current (mA) 20(Max)
Switching Frequency (kHz) 650(Typ)
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package MSOP
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 3
Package Width (mm) 3
Package Height (mm) 0.86
Package Diameter (mm) N/R
Package Overall Length (mm) 3
Package Overall Width (mm) 4.9
Package Overall Height (mm) 1.1(Max)
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Micro Small Outline Package
Package Family Name SO
Jedec MO-187AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 50


ECAD MODELS



APPLICATIONS
• GaAs FET Bias Generators
• Negative Supply Generators
• Battery-Powered Systems
• Single Supply Applications

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