 |
|
| ■ Micropower Operation: Supply Current = 20µA Max
|
| ■ 2-Wire SMBus Interface
|
| ■ Single 2.7V to ±5V Supply Operation |
| ■ Expandable to 32 Single or 16 Differential Channels |
| ■ Guaranteed Break-Before-Make |
| ■ Low RON: 35Ω Single Ended/70Ω Differentia |
| ■ Low Charge Injection: 20pC Max |
| ■ Low Leakage: ±5nA Max |
| ■ Available in 16-Lead SO and GN Packages |
|
| CATALOG |
| LTC1380IS#PBF COUNTRY OF ORIGIN |
| LTC1380IS#PBF PARAMETRIC INFO |
| LTC1380IS#PBF PACKAGE INFO |
| LTC1380IS#PBF MANUFACTURING INFO |
| LTC1380IS#PBF PACKAGING INFO |
| LTC1380IS#PBF ECAD MODELS |
| LTC1380IS#PBF FUNCTIONAL BLOCK DIAGRAM |
| LTC1380IS#PBF APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
| United States of America |
|
| PARAMETRIC INFO |
| Type |
Analog Multiplexer |
| Number of Channels per Chip |
1 |
| Multiplexer Architecture |
8:1 |
| Maximum On Resistance Range (Ohm) |
400 to 1000 |
| Configuration |
Single 8:1 |
| Number of Inputs per Chip |
8 |
| Function |
General |
| Number of Outputs per Chip |
1 |
| Chip Enable Signals |
No |
| Maximum On Resistance (Ohm) |
400@2.7V |
| Maximum Turn-On Time (ns) |
1130(Typ)@2.7V |
| Maximum Turn-Off Time (ns) |
670(Typ)@2.7V |
| Maximum Power Dissipation (mW) |
500 |
| Input Signal Type |
Single |
| Output Signal Type |
Single |
| Maximum High Level Output Current (mA) |
65 |
| Special Features |
Break-Before-Make |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Power Supply Type |
Single|Dual |
| Minimum Single Supply Voltage (V) |
2.7 |
| Typical Single Supply Voltage (V) |
3|5|9 |
| Maximum Single Supply Voltage (V) |
10 |
| Minimum Dual Supply Voltage (V) |
±1.35 |
| Typical Dual Supply Voltage (V) |
±3 |
| Maximum Dual Supply Voltage (V) |
±5 |
| Typical Supply Current (mA) |
0.01@5V/-0.0001@-5V |
| Maximum Supply Current (mA) |
0.02@5V/-0.005@-5V@-40C to 85C |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
10.01(Max) |
| Package Width (mm) |
3.99(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10.01(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AC |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging |
Tube |
| Quantity Of Packaging |
50 |
|
| |
| ECAD MODELS |
|
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| ■ Data Acquisition Systems |
| ■ Process Control |
| ■ Laptop Computers |
| ■ Signal Multiplexing/Demultiplexing |
| ■ Analog-to-Digital Conversion Systems
|
|
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