LTC1440IDD#PBF Analog Devices IC COMP SGL LP 1.182V REF 8-DFN

label:
2023/10/25 417


■ Ultralow Quiescent Current: 2.1µA Typ (LTC1440)  
■ Reference Output Drives 0.01µF Capacitor
■ Adjustable Hysteresis (LTC1440/LTC1442)
■ Wide Supply Range:
   - Single: 2V to 11V
   - Dual: ±1V to ±5.5V
■ Input Voltage Range Includes the Negative Supply
■ TTL/CMOS Compatible Outputs
■ 12µs Propagation Delay with 10mV Overdrive
■ No Crowbar Current
■ 40mA Continuous Source Current
■ Pin Compatible Upgrades for MAX921/922/923
■ 3mm x 3mm x 0.75mm DFN Package (LTC1440)  


CATALOG
LTC1440IDD#PBF COUNTRY OF ORIGIN
LTC1440IDD#PBF PARAMETRIC INFO
LTC1440IDD#PBF PACKAGE INFO
LTC1440IDD#PBF MANUFACTURING INFO
LTC1440IDD#PBF PACKAGING INFO
LTC1440IDD#PBF ECAD MODELS
LTC1440IDD#PBF APPLICATIOS


COUNTRY OF ORIGIN
Malaysia
United States of America


PARAMETRIC INFO
Rail to Rail No
Manufacturer Type Ultra Low Power Comparator
Number of Channels per Chip 1
Typical PSRR (dB) 80
Output Type CMOS/TTL
Maximum Input Offset Voltage (mV) 10@5V@-40C to 85C
Typical CMRR (dB) 80
Strobe Capability No
Typical Output Current (mA) 0.02@5V
Maximum Propagation Delay Time (ns) 15000(Typ)
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single|Dual
Maximum Operating Supply Voltage (V) ±5.5|11
Minimum Single Supply Voltage (V) 2
Typical Single Supply Voltage (V) 3|5|9
Maximum Single Supply Voltage (V) 11
Minimum Dual Supply Voltage (V) ±1
Typical Dual Supply Voltage (V) ±3|±5
Maximum Dual Supply Voltage (V) ±5.5
Maximum Supply Current (mA) 4.4@5V@-40C to 85C
Maximum Power Dissipation (mW) 500
 
PACKAGE INFO
Supplier Package DFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 8
Lead Shape No Lead
PCB 8
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 3
Package Width (mm) 3
Package Height (mm) 0.75(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3
Package Overall Width (mm) 3
Package Overall Height (mm) 0.75
Seated Plane Height (mm) 0.75
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Dual Flat Package No Lead, Exposed Pad
Package Family Name DFN
Jedec MO-229
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 121
 
ECAD MODELS


APPLICATIOS
■ Battery-Powered System Monitoring
■ Threshold Detectors
■ Window Comparators
■ Oscillator Circuits


Продукт RFQ