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• Integrated Precision Reference 2.5V Full-Scale 10ppm/°C (LTC2631-L) 4.096V Full-Scale 10ppm/°C (LTC2631-H)
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• Maximum INL Error: 1LSB (LTC2631A-12)
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• Bidirectional Reference: Input or 10ppm/°C Output
|
• 400kHz I2C Interface
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• Nine Selectable Addresses (LTC2631-Z)
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• Low Noise (0.7mVP-P , 0.1Hz to 200kHz)
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• Guaranteed Monotonic Over Temperature
|
|
| CATALOG |
LTC2631CTS8-LZ10#TRMPBF COUNTRY OF ORIGIN
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LTC2631CTS8-LZ10#TRMPBF PARAMETRIC INFO
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LTC2631CTS8-LZ10#TRMPBF PACKAGE INFO
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LTC2631CTS8-LZ10#TRMPBF MANUFACTURING INFO
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LTC2631CTS8-LZ10#TRMPBF PACKAGING INFO
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LTC2631CTS8-LZ10#TRMPBF ECAD MODELS
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LTC2631CTS8-LZ10#TRMPBF APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Malaysia
|
|
PARAMETRIC INFO
|
| Resolution |
10bit |
| Number of DAC Channels |
1 |
| Number of Outputs per Chip |
1 |
| Converter Type |
General Purpose |
| Output Type |
Voltage |
| Voltage Reference |
Internal|External |
| Maximum Settling Time (us) |
3.8(Typ) |
| Interface Type |
Serial (2-Wire, I2C) |
| Output Polarity |
Unipolar |
| Integral Nonlinearity Error |
±1LSB |
| Full Scale Error |
±0.4%FSR |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
70 |
| Supplier Temperature Grade |
Commercial |
| Power Supply Type |
Single |
| Minimum Single Supply Voltage (V) |
2.7 |
| Typical Single Supply Voltage (V) |
3.3|5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Digital Supply Support |
No |
|
|
PACKAGE INFO
|
| Supplier Package |
TSOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.75(Max) |
| Package Height (mm) |
0.9(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.8 |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.36(Max) |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-193BA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TRM |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
 |
|
| APPLICATIONS |
| • Mobile Communications |
| • Process Control and Industrial Automation |
| • Automatic Test Equipment |
| • Portable Equipment |
| • Automotive |
| • Optical Networking |
| |
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