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• Six Programmable Output Ranges:Unipolar: 0V to 5V, 0V to 10VBipolar: ±5V, ±10V, ±2.5V, –2.5V to 7.5V
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• Serial Readback of All On-Chip Registers
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• 1LSB INL and DNL Over the IndustrialTemperature Range (LTC2704-14/LTC2704-12)
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• Force/Sense Outputs Enable Remote Sensing
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• Glitch Impulse: < 2nV-sec
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• Outputs Drive ±5mA
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• Pin Compatible 12-, 14- and 16-Bit Parts
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• Power-On and Clear to Zero Volts
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• 44-Lead SSOP Package
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CATALOG |
LTC2704CGW-16#PBF Country of Origin
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LTC2704CGW-16#PBF Parametric Info
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LTC2704CGW-16#PBF Package Info
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LTC2704CGW-16#PBF Manufacturing Info
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LTC2704CGW-16#PBF Packaging Info
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LTC2704CGW-16#PBF ECAD Models
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LTC2704CGW-16#PBF FUNCTIONAL BLOCK DIAGRAM
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LTC2704CGW-16#PBF APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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PARAMETRIC INFO
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C |
16bit |
Number of DAC Channels |
4 |
Number of Outputs per Chip |
4 |
Converter Type |
General Purpose |
Output Type |
Voltage |
Voltage Reference |
External |
Maximum Settling Time (us) |
10(Typ) |
Digital Interface Type |
Serial (3-Wire, SPI) |
Output Polarity |
Unipolar|Bipolar |
Integral Nonlinearity Error |
±2LSB |
Full Scale Error |
±20LSB |
Minimum Operating Temperature (°C) |
0 |
Maximum Operating Temperature (°C) |
70 |
Power Supply Type |
Dual |
Minimum Dual Supply Voltage (V) |
±4.5 |
Typical Dual Supply Voltage (V) |
±15 |
Maximum Dual Supply Voltage (V) |
±16.5 |
Digital Supply Support |
Yes |
Maximum Power Dissipation (mW) |
87.5(Typ) |
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PACKAGE INFO
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Supplier Package |
SSOP W |
Pin Count |
44 |
PCB |
44 |
Tab |
N/R |
Pin Pitch (mm) |
0.8 |
Package Length (mm) |
17.93(Max) |
Package Width (mm) |
7.6(Max) |
Package Height (mm) |
2.39(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
2.64(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Shrink Small Outline Package Wide Body |
Package Family Name |
SO |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
260 |
Wave Solder Time (Sec) |
10 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
Ag |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging |
Tube |
Quantity Of Packaging |
27 |
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ECAD MODELS
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FUNCTIONAL BLOCK DIAGRAM |

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APPLICATIONS
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• Process Control and Industrial Automation
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• Direct Digital Waveform Generation
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• Software Controlled Gain Adjustment
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• Automated Test Equipment
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