LTC2704CGW-16#PBF Analog Devices IC DAC 16BIT QUAD VOUT 44-SSOP

label:
2024/03/6 312



• Six Programmable Output Ranges:Unipolar: 0V to 5V, 0V to 10VBipolar: ±5V, ±10V, ±2.5V, –2.5V to 7.5V
• Serial Readback of All On-Chip Registers
• 1LSB INL and DNL Over the IndustrialTemperature Range (LTC2704-14/LTC2704-12)
• Force/Sense Outputs Enable Remote Sensing
• Glitch Impulse: < 2nV-sec
• Outputs Drive ±5mA
• Pin Compatible 12-, 14- and 16-Bit Parts
• Power-On and Clear to Zero Volts
• 44-Lead SSOP Package


CATALOG
LTC2704CGW-16#PBF Country of Origin
LTC2704CGW-16#PBF Parametric Info
LTC2704CGW-16#PBF Package Info
LTC2704CGW-16#PBF Manufacturing Info
LTC2704CGW-16#PBF Packaging Info
LTC2704CGW-16#PBF ECAD Models
LTC2704CGW-16#PBF FUNCTIONAL BLOCK DIAGRAM
LTC2704CGW-16#PBF APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
C 16bit
Number of DAC Channels 4
Number of Outputs per Chip 4
Converter Type General Purpose
Output Type Voltage
Voltage Reference External
Maximum Settling Time (us) 10(Typ)
Digital Interface Type Serial (3-Wire, SPI)
Output Polarity Unipolar|Bipolar
Integral Nonlinearity Error ±2LSB
Full Scale Error ±20LSB
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Power Supply Type Dual
Minimum Dual Supply Voltage (V) ±4.5
Typical Dual Supply Voltage (V) ±15
Maximum Dual Supply Voltage (V) ±16.5
Digital Supply Support Yes
Maximum Power Dissipation (mW) 87.5(Typ)


PACKAGE INFO
Supplier Package SSOP W
Pin Count 44
PCB 44
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 17.93(Max)
Package Width (mm) 7.6(Max)
Package Height (mm) 2.39(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 2.64(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Shrink Small Outline Package Wide Body
Package Family Name SO
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 27


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM



APPLICATIONS
• Process Control and Industrial Automation
• Direct Digital Waveform Generation
• Software Controlled Gain Adjustment
• Automated Test Equipment


Продукт RFQ