|
|
• 3.3V Supply Voltage
|
• 20Mbps Maximum Data Rate
|
• No Damage or Latchup Up to ±15kV HBM
|
• High Input Impedance Supports 256 Nodes
(C-, I-Grade)
|
• Operation Up to 125°C (H-Grade)
|
| • Current Limited Drivers and Thermal Shutdown |
| • Delayed Micropower Shutdown: 5µA Maximum
(C-, I-Grade) |
| • Power Up/Down Glitch-Free Driver Outputs |
• Low Operating Current: 370µA Typical in
Receive Mode
|
| • Compatible with TIA/EIA-485-A Specifications |
| • Available in 8-Pin and 10-Pin 3mm × 3mm DFN,
8-Pin and 10-Pin MSOP, and 8-Pin and 14-Pin
SO Packages |
|
| CATALOG |
LTC2851HDD#TRPBF COUNTRY OF ORIGIN
|
LTC2851HDD#TRPBF PARAMETRIC INFO
|
LTC2851HDD#TRPBF PACKAGE INFO
|
LTC2851HDD#TRPBF MANUFACTURING INFO
|
LTC2851HDD#TRPBF PACKAGING INFO
|
LTC2851HDD#TRPBF ECAD MODELS
|
LTC2851HDD#TRPBF APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| Malaysia |
|
PARAMETRIC INFO
|
| Function |
Line Transceiver |
| Number of Transceivers |
1 |
| Number of Transmitters |
1 |
| Number of Receivers |
1 |
| Data Transmission Topology |
Multipoint |
| Transmitter Signal Type |
Differential |
| Receiver Signal Type |
Differential |
| Transmitter Communication Type |
RS-422|RS-485 |
| Charge Pump |
No |
| Receiver Communication Type |
RS-422|RS-485 |
| Channel Operating Mode |
Full Duplex |
| Fail Safe |
Open/Short |
| Interface Standards |
EIA/TIA-485-A|RS-422|RS-485 |
| Number of Drivers per Line |
1 |
| Number of Receivers per Line |
1 |
| Data Rate |
20Mbps(Min) |
| Driving Mode |
3-State |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Single |
| Typical Single Supply Voltage (V) |
3.3 |
| Minimum Single Supply Voltage (V) |
3 |
| Maximum Single Supply Voltage (V) |
3.6 |
| Maximum Supply Current (mA) |
1 |
| Isolation |
No |
|
|
PACKAGE INFO
|
| Supplier Package |
DFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
No Lead |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.75(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
3 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Dual Flat Package No Lead, Exposed Pad |
| Package Family Name |
DFN |
| Jedec |
MO-229 |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Low Power RS485/RS422 Transceiver
|
| • Level Translator |
• Backplane Transceiver
|
|
| |
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