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• Integrated, Logic-Selectable 120Ω TerminationResistor
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• 20Mbps Max Data Rate
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• No Damage or Latchup to ESD: ±15kV HBM
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• High Input Impedance Supports 256 Nodes(C-, I-Grades)
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• Operation Up to 105°C (LTC2859H)
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• 250kbps Low-EMI Mode
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• Guaranteed Failsafe Receiver Operation Over theEntire Common Mode Range
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• Current Limited Drivers and Thermal Shutdown
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• Delayed Micropower Shutdown (5µA Max)
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• Power Up/Down Glitch-Free Driver Outputs
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• Low Operating Current (900µA Max in Receive Mode)
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• Meets All TIA/EIA-485-A Specifications
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• Available in 10-Pin 3mm × 3mm DFN, 12-Pin4mm × 3mm DFN and 16-Pin SSOP Packages
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| CATALOG |
LTC2859IDD#PBF COUNTRY OF ORIGIN
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LTC2859IDD#PBF PARAMETRIC INFO
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LTC2859IDD#PBF PACKAGE INFO
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LTC2859IDD#PBF MANUFACTURING INFO
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LTC2859IDD#PBF PACKAGING INFO
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LTC2859IDD#PBF ECAD MODELS
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LTC2859IDD#PBF FUNCTIONAL BLOCK DIAGRAMS
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LTC2859IDD#PBF APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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China
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United States of America
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PARAMETRIC INFO
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| Function |
Line Transceiver |
| Number of Transceivers |
1 |
| Number of Transmitters |
1 |
| Number of Receivers |
1 |
| Data Transmission Topology |
Multidrop|Multipoint |
| Transmitter Signal Type |
Differential |
| Receiver Signal Type |
Differential |
| Transmitter Communication Type |
RS-422|RS-485 |
| Charge Pump |
No |
| Receiver Communication Type |
RS-422|RS-485 |
| Power Down Mode |
Shutdown |
| Typical Shutdown Current (uA) |
5(Max) |
| Channel Operating Mode |
Half Duplex |
| Fail Safe |
Open/Short |
| Interface Standards |
EIA/TIA-485-A|RS-232|RS-485 |
| Number of Transmitter Enables |
1 |
| Number of Receiver Enables |
1 |
| Number of Drivers per Line |
1@RS-422|256@RS-485 |
| Number of Receivers per Line |
10@RS-422|256@RS-485 |
| Data Rate |
20Mbps(Min) |
| Driving Mode |
3-State |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Single |
| Typical Single Supply Voltage (V) |
5 |
| Minimum Single Supply Voltage (V) |
4.5 |
| Maximum Single Supply Voltage (V) |
5.5 |
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|
PACKAGE INFO
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| Supplier Package |
DFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
No Lead |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.75(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
3 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Dual Flat Package No Lead, Exposed Pad |
| Package Family Name |
DFN |
| Jedec |
MO-229WEED-2 |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
121 |
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ECAD MODELS
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| FUNCTIONAL BLOCK DIAGRAMS |
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APPLICATIONS
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• Low Power RS485/RS422 Transceiver
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• Level Translator
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• Backplane Transceiver
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