LTC3114HFE-1#TRPBF Analog Devices IC REG BCK BST ADJ 1A SYNC 16TSS

label:
2023/10/10 386




• Regulates VOUT Above, Below or Equal to VIN
• Single Inductor
• Wide VIN Range: 2.2V to 40V
• Wide VOUT Range: 2.7V to 40V
• 1A Output Current in Buck Mode
• 0.5A Output Current, VIN = 3.6V, VOUT = 5V
• Programmable Average Output Current
• Up to 96% Efficiency
• Burst Mode® Operation, 30µA No-Load IQ
• Current Mode Control
• 1.2MHz Ultralow Noise PWM
• Accurate RUN Pin Threshold


CATALOG
LTC3114HFE-1#TRPBF COUNTRY OF ORIGIN
LTC3114HFE-1#TRPBF PARAMETRIC INFO
LTC3114HFE-1#TRPBF PACKAGE INFO
LTC3114HFE-1#TRPBF MANUFACTURING INFO
LTC3114HFE-1#TRPBF PACKAGING INFO
LTC3114HFE-1#TRPBF ECAD MODELS
LTC3114HFE-1#TRPBF BLOCK DIAGRAM
LTC3114HFE-1#TRPBF APPLICATIONS


COUNTRY OF ORIGIN
United States of America


PARAMETRIC INFO
Type Synchronous Step Down|Step Up
Number of Outputs 1
Minimum Input Voltage (V) 2.2
Maximum Input Voltage (V) 40
Output Voltage (V) 2.7 to 40
Maximum Output Current (A) 1
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 150
Supplier Temperature Grade Automotive
Switching Frequency (kHz) 1000 to 1400
Efficiency (%) 96
Switching Regulator Yes
Output Type Adjustable
Load Regulation 0.8%
Line Regulation 0.2%
Typical Quiescent Current (uA) 3
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package TSSOP EP
Basic Package Type Lead-Frame SMT
Pin Count 16
Lead Shape Gull-wing
PCB 16
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 5.1(Max)
Package Width (mm) 4.5(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Thin Shrink Small Outline Package, Exposed Pad
Package Family Name SOP
Jedec MO-153ABT
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 16.4
Tape Pitch (mm) 8
Tape Width (mm) 16
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS



BLOCK DIAGRAM



APPLICATIONS
• 24V/28V Industrial Power Supply
• 12V Lead-Acid to 12V Regulator
• High Power LED Driver
• 12V/24V Solar Panel Battery Charging Systems
• Automotive Power Systems
Продукт RFQ