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• Programmable Average Input Current Limit
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• 5% Input Current Accuracy
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• 200mA to 1000mA Program Range
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| • VIN: 1.8V to 5.5V, VOUT: 2V to 5.25V
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| • Supports High Current GSM/GPRS Load Burst |
| • VIN > VOUT Operation |
| • 1.6MHz Fixed Frequency Operation |
| • Internal Current Sense Resistor |
| • 1.2A Peak Current Limit |
| • Up to 93% Effi ciency |
| • Output Disconnect in Shutdown |
| • Soft-Start |
| • Low Quiescent Current Burst Mode® Operation |
| • Available in 2mm × 3mm × 0.75mm DFN Package |
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| CATALOG |
| LTC3125EDCB#TRPBF COUNTRY OF ORIGIN |
LTC3125EDCB#TRPBF PARAMETRIC INFO
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LTC3125EDCB#TRPBF PACKAGE INFO
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LTC3125EDCB#TRPBF MANUFACTURING INFO
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LTC3125EDCB#TRPBF PACKAGING INFO
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LTC3125EDCB#TRPBF EACD MODELS
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| LTC3125EDCB#TRPBF APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Thailand |
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PARAMETRIC INFO
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| Type |
Synchronous Step Up |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
1.8 |
| Maximum Input Voltage (V) |
5.5 |
| Output Voltage (V) |
2 to 5.25 |
| Maximum Output Current (A) |
1.2 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended |
| Switching Frequency (kHz) |
1900 |
| Efficiency (%) |
93 |
| Switching Regulator |
Yes |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
300 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
125 |
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PACKAGE INFO
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| Supplier Package |
DFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
No Lead |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.45 |
| Package Length (mm) |
2 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.75(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Dual Flat Package No Lead, Exposed Pad |
| Package Family Name |
DFN |
| Jedec |
MO-229 |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • GSM/GPRS PCMCIA/CompactFlash PC Card Modems |
| • Wireless Emergency Locators |
| • Portable Radios |
| • Supercap Chargers |
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