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• Wide VIN Range: 3.1V to 60V
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• Wide VOUT Range: 0V to (VIN – 0.5V)
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• Integrated 110mΩ Top N-Channel/50mΩ Bottom N-Channel MOSFETs
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| • 95% Efficiency with 12VIN and 5VOUT
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| • Regulated IQ: 440µA, Shutdown IQ: 18µA |
| • Accurate Current Monitoring (±4%) without Sense Resistor |
| • Accurate Resistor Programmable Frequency(300kHz to 3MHz) with ±50% Frequency Sync Range |
| • Accurate Programmable Output Current |
| • Input Voltage Regulation for MPPT Applications |
| • ±0.8% Output Voltage Accuracy |
| • Peak Current Mode Operation |
| • Programmable Wire Drop Compensation |
| • Burst Mode® Operation, Forced Continuous Mode |
| • Internal Compensation and Programmable Soft-Start |
| • Overtemperature Protection |
| • Available in Thermally Enhanced 28-Lead (4mm × 5mm) QFN and TSSOP Packages |
| |
| CATALOG |
| LTC3649EFE#PBF COUNTRY OF ORIGIN |
LTC3649EFE#PBF PARAMETRIC INFO
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LTC3649EFE#PBF PACKAGE INFO
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LTC3649EFE#PBF MANUFACTURING INFO
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LTC3649EFE#PBF PACKAGING INFO
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LTC3649EFE#PBF EACD MODELS
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| LTC3649EFE#PBF APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Malaysia |
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PARAMETRIC INFO
|
| type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
3.1 |
| Maximum Input Voltage (V) |
60 |
| Output Voltage (V) |
0 to 59.5 |
| Maximum Output Current (A) |
4 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Rating |
Extended |
| Switching Frequency (kHz) |
300 to 3000 |
| Switching Regulator |
yes |
| Operating Supply Voltage (V) |
3.1 to 60 |
| Output Type |
Adjustable |
| Load Regulation |
0.5% |
| Line Regulation |
0.5% |
| Typical Quiescent Current (uA) |
1400 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
125 |
| Typical Switch Current (A) |
6 |
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PACKAGE INFO
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| Supplier packaging |
TSSOP EP |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
28 |
| Pin shape |
Gull-wing |
| PCB |
28 |
| ears |
N/R |
| Pin spacing (mm) |
0.65 |
| Package length (mm) |
9.8(Max) |
| Package width (mm) |
4.5(Max) |
| Package height (mm) |
1.05(Max) |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
9.8(Max) |
| Package Overall Width (mm) |
6.4 |
| Package Overall Height (mm) |
1.2(Max) |
| Mounting surface height (mm) |
1.2(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Thin Shrink Small Outline Package, Exposed Pad |
| Package series name |
SO |
| JEDEC |
MO-153AET |
| Package outline |
Link to datasheet |
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|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
260 |
| Wave soldering time (seconds) |
10 |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Plating materials |
Ag |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Package |
Tube |
| Packing quantity |
50 |
| packaging type file |
Link to datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Industrial Applications |
| • Automotive Applications |
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