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• 4-Switch Current Mode Single Inductor Architecture Allows VIN Above, Below or Equal to VOUT
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• Wide VIN Range: 4.5V to 150V
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• Wide Output Voltage Range: 1.2V ≤ VOUT ≤ 150V
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| • Synchronous Rectification: Up to 99% Efficiency |
| • ±1% 1.2V Voltage Reference |
| • Input or Output Average Current Limit |
| • Onboard LDO or External NMOS LDO for DRVCC |
| • 36V EXTVCC LDO Powers Drivers |
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| CATALOG |
| LTC3779EFE#PBF COUNTRY OF ORIGIN |
LTC3779EFE#PBF PARAMETRIC INFO
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LTC3779EFE#PBF PACKAGE INFO
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LTC3779EFE#PBF MANUFACTURING INFO
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LTC3779EFE#PBF PACKAGING INFO
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LTC3779EFE#PBF EACD MODELS
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| LTC3779EFE#PBF APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Thailand |
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PARAMETRIC INFO
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| Topology |
Step Down|Step Up |
| Number of Outputs |
1 |
| Maximum Switching Frequency (kHz) |
275 |
| Output Voltage (V) |
1.2 to 150 |
| Typical Output Current (A) |
10 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Input Voltage (V) |
150 |
| Minimum Input Voltage (V) |
4.5 |
| Synchronous Rectifier |
Yes |
| Operating Supply Voltage (V) |
4.5 to 150 |
| Synchronous Clock |
Yes |
| Maximum Supply Current (mA) |
3.6(Typ) |
| Minimum Switching Frequency (kHz) |
225 |
| Typical Switching Frequency (kHz) |
250 |
| Programmability |
Yes |
| Control Method |
PWM |
| Typical Gate Driver Pull Up Resistance (Ohm) |
3.1/5.5 |
| Typical Gate Driver Pull Down Resistance (Ohm) |
1.3/3 |
| Supplier Temperature Grade |
Extended |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
TSSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
31 |
| Lead Shape |
Gull-wing |
| PCB |
31 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
9.8(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package, Exposed Pad |
| Package Family Name |
SO |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
50 |
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ECAD MODELS
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| APPLICATIONS |
| • Industrial, Automotive, Medical, Military, Avionics
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