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• Single Inductor Architecture Allows VIN Above, Below or Equal to the Regulated VOUT
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• Programmable Input or Output Current
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• Wide VIN Range: 4V to 38V
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• 1% Output Voltage Accuracy: 0.8V < VOUT < 38V
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• Synchronous Rectification: Up to 98% Efficiency
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| CATALOG |
LTC3789IGN#TRPBF COUNTRY OF ORIGIN
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LTC3789IGN#TRPBF PARAMETRIC INFO
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LTC3789IGN#TRPBF PARAMETRIC INFO
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LTC3789IGN#TRPBF MANUFACTURING INFO
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LTC3789IGN#TRPBF PACKAGING INFO
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LTC3789IGN#TRPBF ECAD MODELS
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LTC3789IGN#TRPBF APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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PARAMETRIC INFO
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| Topology |
Step Down|Step Up |
| Number of Outputs |
1 |
| Maximum Switching Frequency (kHz) |
710 |
| Output Voltage (V) |
0.8 to 38 |
| Typical Output Current (A) |
10 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Input Voltage (V) |
38 |
| Minimum Input Voltage (V) |
4 |
| Synchronous Rectifier |
Yes |
| Operating Supply Voltage Range (V) |
4 to 38 |
| Synchronous Clock |
Yes |
| Maximum Supply Current (mA) |
3(Typ) |
| Minimum Switching Frequency (kHz) |
570 |
| Typical Switching Frequency (kHz) |
640 |
| Programmability |
Yes |
| Supplier Temperature Grade |
Industrial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
125 |
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|
PARAMETRIC INFO
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| Supplier Package |
SSOP N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
28 |
| Lead Shape |
Gull-wing |
| PCB |
28 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.64 |
| Package Length (mm) |
9.98(Max) |
| Package Width (mm) |
3.99(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Shrink Small Outline Package Narrow Body |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
 |
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| APPLICATIONS |
| • Automotive Systems |
| • Distributed DC Power Systems |
| • High Power Battery-Operated Devices |
| • Industrial Control |
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