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• 1MHz I2C Compatible Serial Control Interface
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• Pin or I2C Programmable PD Power Up to 71.3W
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• Available in a 40-Lead 6mm × 6mm (LTC4292) and 24-Lead 4mm × 4mm (LTC4291-1) QFN Packages
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• Continuous, Dedicated Per-Port Power and Current Monitoring Per-Port Power Policing
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| CATALOG |
LTC4291IUF-1#PBF COUNTRY OF ORIGIN
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LTC4291IUF-1#PBF PARAMETRIC INFO
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LTC4291IUF-1#PBF PACKAGE INFO
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LTC4291IUF-1#PBF MANUFACTURING INFO
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LTC4291IUF-1#PBF PACKAGING INFO
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LTC4291IUF-1#PBF ECAD MODELS
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LTC4291IUF-1#PBF APPLICATIONS
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COUNTRY OF ORIGIN
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Thailand
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Malaysia
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PARAMETRIC INFO
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| Standard Supported |
IEEE802.3af/IEEE802.3at/IEEE802.3bt |
| Maximum Duty Cycle (%) |
6.7 |
| Maximum Input Voltage (V) |
3.6 |
| Minimum Input Voltage (V) |
3 |
| Maximum Output Power (W) |
71.3 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Operating Temperature (°C) |
-40 |
| Supplier Temperature Grade |
Industrial |
| Programmability |
Yes |
| UVLO Turn-On Threshold (V) |
2.7 |
| Type |
PSE Controller |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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|
PACKAGE INFO
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| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.73 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.25 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220-WGGD-X |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
0.75 |
| Minimum PACKAGE_DIMENSION_H |
0.7 |
| Maximum PACKAGE_DIMENSION_L |
4.1 |
| Minimum PACKAGE_DIMENSION_L |
3.9 |
| Maximum PACKAGE_DIMENSION_W |
4.1 |
| Minimum PACKAGE_DIMENSION_W |
3.9 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
0.8 |
| Minimum Seated_Plane_Height |
0.7 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.03 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.4 |
| Terminal Thickness (mm) |
0.2 |
| Bottom Pad Length (mm) |
2.45 |
| Bottom Pad Width (mm) |
2.45 |
| Bottom Pad Chamfer |
0.35 |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
91 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • PoE PSE Switches/Routers |
| • PoE PSE Midspans |
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