|
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• Reduces Power Dissipation by Replacing a Power Schottky Diode
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• Wide Operating Voltage Range: 4V to 80V
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• Reverse Input Protection to – 40V
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• Low 9µA Shutdown Current
|
• Low 150μA Operating Current
|
• Smooth Switchover without Oscillation
|
• Controls Single or Back-to-Back N-Channel MOSFETs
|
|
| CATALOG |
LTC4359IDCB#TRPBF COUNTRY OF ORIGIN
|
LTC4359IDCB#TRPBF PARAMETRIC INFO
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LTC4359IDCB#TRPBF PACKAGE INFO
|
LTC4359IDCB#TRPBF MANUFACTURING INFO
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LTC4359IDCB#TRPBF PACKAGING INFO
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LTC4359IDCB#TRPBF ECAD MODELS
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LTC4359IDCB#TRPBF APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Philippines
|
Thailand
|
Malaysia
|
|
PARAMETRIC INFO
|
| FET Type |
N-Channel |
| Number of Drivers |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Minimum Operating Supply Voltage (V) |
4 |
| Maximum Operating Supply Voltage (V) |
80 |
| Maximum Supply Current (mA) |
0.2 |
| Maximum Turn-On Time (ns) |
200000(Typ) |
| Maximum Turn-Off Time (ns) |
500 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
DFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
No Lead |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
2 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.75(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2 |
| Package Overall Width (mm) |
3 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Dual Flat Package No Lead, Exposed Pad |
| Package Family Name |
DFN |
| Jedec |
MO-229WCED-1 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Automotive Battery Protection |
| • Redundant Power Supplies |
| • Supply Holdup |
| • Telecom Infrastructure |
| • Computer Systems/Servers |
| • Solar Systems |
| |
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