|
|
• Bootstrap Supply Voltage to 114V
|
• Wide VCC Voltage: 4.5V to 13.5V
|
• Adaptive Shoot-Through Protection
|
• 1.4A Peak Top Gate Pull-Up Current
|
• 1.75A Peak Bottom Gate Pull-Up Current
|
• 1.5Ω Top Gate Driver Pull-Down
|
|
| CATALOG |
LTC4444IMS8E-5#PBF COUNTRY OF ORIGIN
|
LTC4444IMS8E-5#PBF PARAMETRIC INFO
|
LTC4444IMS8E-5#PBF PACKAGE INFO
|
LTC4444IMS8E-5#PBF MANUFACTURING INFO
|
LTC4444IMS8E-5#PBF PACKAGING INFO
|
LTC4444IMS8E-5#PBF ECAD MODELS
|
LTC4444IMS8E-5#PBF APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
|
PARAMETRIC INFO
|
| Driver Type |
High Side|Low Side |
| Number of Drivers |
2 |
| Driver Configuration |
Non-Inverting |
| Input Logic Compatibility |
CMOS |
| Maximum Operating Supply Voltage (V) |
13.5 |
| Peak Output Current (A) |
1.75(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Type |
MOSFET |
| Maximum Operating Temperature (°C) |
125 |
| High and Low Sides Dependency |
Independent |
| Number of Outputs |
2 |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Maximum Supply Current (mA) |
0.52 |
| Output Resistance (Ohm) |
0.75|1.5 |
| Supplier Temperature Grade |
Industrial |
| Absolute Propagation Delay Time (ns) |
60 |
| Maximum Propagation Delay Time (ns) |
60 |
| Maximum Rise Time (ns) |
80(Typ) |
| Maximum Fall Time (ns) |
50(Typ) |
| Typical Input High Threshold Voltage (V) |
2.75 |
| Typical Input Low Threshold Voltage (V) |
2.3 |
| Special Features |
Under Voltage Lockout |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
MSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.86 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
4.9 |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.38(Max) |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package, Exposed Pad |
| Package Family Name |
SO |
| Jedec |
MO-187AA-T |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
|
| PACKAGING INFO |
| Packaging |
Tube |
| Quantity Of Packaging |
50 |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Distributed Power Architectures |
| • Automotive Power Supplies |
| • High Density Power Modules |
| • Telecommunication Systems |
| |
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