|
|
• 25dBm OIP3
|
• –0.6dB Conversion Gain
|
• 14.1dB Noise Figure at 5.8GHz
|
• –154dBm/Hz Output Noise Floor
|
• Low LO-RF Leakage
|
|
| CATALOG |
LTC5576IUF#PBF COUNTRY OF ORIGIN
|
LTC5576IUF#PBF PARAMETRIC INFO
|
LTC5576IUF#PBF PACKAGE INFO
|
LTC5576IUF#PBF MANUFACTURING INFO
|
LTC5576IUF#PBF PACKAGING INFO
|
LTC5576IUF#PBF ECAD MODELS
|
LTC5576IUF#PBF APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Thailand
|
|
PARAMETRIC INFO
|
| Maximum Input Frequency (MHz) |
6000 |
| Maximum Output Frequency (MHz) |
8000 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Conversion Gain (dB) |
0.7 |
| Minimum Input Frequency (MHz) |
30 |
| Minimum Output Frequency (MHz) |
3000 |
| Minimum Operating Supply Voltage (V) |
3.1|4.5 |
| Maximum Operating Supply Voltage (V) |
3.5|5.3 |
| Operating Supply Voltage (V) |
3.3|5 |
| Typical Noise Figure (dB) |
17.8 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
No Lead |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.75(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.3 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220WGGC |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
91 |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Wideband Transmitters |
| • 4G and 5G Wireless Infrastructure |
| • Fixed Wireless Access Equipment |
| • Wireless Repeaters |
| |
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