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• Ultra Wide Matched Input Frequency Range:100MHz to 40GHz
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• 35dB Linear Dynamic Range (< ±1dB Error)
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• 29mV/dB Logarithmic Slope
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• ±1dB Flat Response from 200MHz to 30GHz
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• Accurate RMS Power Measurement of High Crest Factors (Up to 12dB) Modulated Waveforms
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• Low Power Shutdown Mode
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• Low Supply Current: 30mA at 3.3V (Typical)
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• Small 2mm × 2mm Plastic DFN8 Package
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• I-Grade: –40°C to 105°C Rated H-Grade: –40°C to 125°C Rated with Guaranteed Log-Slope and Log-Intercept
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• ESD Rating: 3500V HBM, 1500V CDM
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|
| CATALOG |
| LTC5596IDC#TRMPBF COUNTRY OF ORIGIN |
LTC5596IDC#TRMPBF PARAMETER INFORMATION
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LTC5596IDC#TRMPBF PACKAGING INFORMATION
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| LTC5596IDC#TRMPBF MANUFACTURING INFORMATION |
LTC5596IDC#TRMPBF PACKAGING INFORMATION
|
LTC5596IDC#TRMPBF ECAD MODELS
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LTC5596IDC#TRMPBF APPLICATIONS
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|
| COUNTRY OF ORIGIN |
| Thailand |
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PARAMETER INFORMATION
|
| Frequency Band (MHz) |
100 to 40000 |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Typical Supply Current (mA) |
30 |
| Accuracy (dB) |
±1 |
| Process Technology |
CMOS |
| Maximum Output Voltage (V) |
5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Thermal Resistance (°C/W) |
25 |
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PACKAGING INFORMATION
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| Supplier Packaging |
DFN EP |
| Basic package types |
Non-Lead-Frame SMT |
| Number of Pins |
8 |
| Pin shape |
No Lead |
| PCB |
8 |
| Ear piece |
N/R |
| Pin spacing (mm) |
0.45 |
| Package length (mm) |
2 |
| Package width (mm) |
2 |
| Package height (mm) |
0.75(Max) |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
2 |
| Package Overall Width (mm) |
2 |
| Package Overall Height (mm) |
0.75 |
| Mounting surface height (mm) |
0.75 |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| package instruction |
Dual Flat Package No Lead, Exposed Pad |
| Package Series Name |
DFN |
|
|
| MANUFACTURING INFORMATION |
| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow time (seconds) |
30 |
| Reflow cycles |
3 |
| standard |
J-STD-020D |
| Lead Finish(Plating) |
Matte Sn annealed |
| Plating materials |
Ag |
| Terminal base material |
Cu Alloy |
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|
PACKAGING INFORMATION
|
| Packaging Suffix |
TRM |
| Package |
Tape and Reel Packaging |
| Packing quantity |
500 |
| Package Type File |
Link to data sheet |
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|
| ECAD MODELS |
 |
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| APPLICATIONS |
| • Point-to-Point Microwave Links |
| • Instrumentation and Measurement Equipment |
| • Military Radios |
| • LTE, WiFi, WiMax Wireless Networks |
| • RMS Power Measurement |
| • Receive and Transmit Gain Control |
| • RF PA Transmit Power Control |
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