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• Input Bias Current: 1pA (Typ at 25°C)
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• Low Offset Voltage: 100μV Max
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• Low Offset Drift: 2.5μV/°C Max
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• 0.1Hz to 10Hz Noise: 1.5μVP-P
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• Slew Rate: 40V/μs
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• Gain Bandwidth Product: 50MHz
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• Output Swings Rail-to-Rail
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CATALOG |
LTC6244HMS8#PBF COUNTRY OF ORIGIN
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LTC6244HMS8#PBF PARAMETRIC INFO
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LTC6244HMS8#PBF PACKAGE INFO
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LTC6244HMS8#PBF MANUFACTURING INFO
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LTC6244HMS8#PBF PACKAGING INFO
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LTC6244HMS8#PBF ECAD MODELS
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LTC6244HMS8#PBF APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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PARAMETRIC INFO
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Manufacturer Type |
High Speed Amplifier |
Type |
High Speed Amplifier |
Rail to Rail |
Rail to Rail Output |
Number of Channels per Chip |
2 |
Minimum Single Supply Voltage (V) |
2.8 |
Process Technology |
CMOS |
Minimum PSRR (dB) |
75 |
Typical Single Supply Voltage (V) |
3|5 |
Output Type |
CMOS |
Maximum Single Supply Voltage (V) |
6 |
Typical Gain Bandwidth Product (MHz) |
30(Min) |
Maximum Input Offset Voltage (mV) |
0.125@5V |
Maximum Input Offset Current (uA) |
0.0000005(Typ)@5V |
Maximum Input Bias Current (uA) |
0.002@5V@-40C to 125C |
Maximum Operating Supply Voltage (V) |
6 |
Maximum Supply Voltage Range (V) |
6 to 9 |
Minimum CMRR (dB) |
74 |
Minimum CMRR Range (dB) |
71 to 75 |
Typical Voltage Gain (dB) |
110.88(Min) |
Typical Slew Rate (V/us) |
17(Min)@5V@-40C to 125C |
Typical Settling Time (ns) |
535 |
Typical Input Noise Voltage Density (nV/rtHz) |
8@5V |
Typical Input Bias Current (uA) |
0.000001@5V |
Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.00056@5V |
Shut Down Support |
No |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Supplier Temperature Grade |
Automotive |
Power Supply Type |
Single |
Maximum Supply Current (mA) |
14.8@5V@-40C to 125C |
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PACKAGE INFO
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Supplier Package |
MSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
3 |
Package Width (mm) |
3 |
Package Height (mm) |
0.86 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3 |
Package Overall Width (mm) |
4.9 |
Package Overall Height (mm) |
1.1(Max) |
Seated Plane Height (mm) |
1.1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Micro Small Outline Package |
Package Family Name |
SO |
Jedec |
MO-187AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
260 |
Wave Solder Time (Sec) |
10 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
Ag |
Terminal Base Material |
Alloy 42 |
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PACKAGING INFO
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Packaging |
Tube |
Quantity Of Packaging |
50 |
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ECAD MODELS
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APPLICATIONS |
• Photodiode Amplifi ers |
• Charge Coupled Amplifi ers |
• Low Noise Signal Processing |
• Active Filters |
• Medical Instrumentation |
• High Impedance Transducer Amplifier |
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