LTC6255IS6#TRMPBF Analog Devices IC OPAMP GP 6.5MHZ RRO TSOT23-6

label:
2025/12/22 11
LTC6255IS6#TRMPBF Analog Devices IC OPAMP GP 6.5MHZ RRO TSOT23-6


• Gain Bandwidth Product: 6.5MHz
• –3dB Bandwidth (AV = +1): 4.5MHz
• Low Quiescent Current: 65µA
• C-Load™ Op Amp Drives all Capacitive Loads
• Offset Voltage: 350µV Maximum
• Rail-to-Rail Input and Output


CATALOG
LTC6255IS6#TRMPBF COUNTRY OF ORIGIN
LTC6255IS6#TRMPBF LIFECYCLE
LTC6255IS6#TRMPBF PARAMETRIC INFO
LTC6255IS6#TRMPBF PACKAGE INFO
LTC6255IS6#TRMPBF PACKAGING INFO
LTC6255IS6#TRMPBF MANUFACTURING INFO
LTC6255IS6#TRMPBF ECAD MODELS
LTC6255IS6#TRMPBF APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


LIFECYCLE
Obsolete
Jan 17,2025


PARAMETRIC INFO
Manufacturer Type Low Power Amplifier
Type Low Power Amplifier
Rail to Rail Rail to Rail Input/Output
Number of Channels per Chip 1
Minimum Single Supply Voltage (V) 1.8
Process Technology 0.35um
Minimum PSRR (dB) 82
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.25
Typical Gain Bandwidth Product (MHz) 6.5
Maximum Quiescent Current (mA) 0.085@5V
Maximum Input Offset Voltage (mV) 0.35@5V
Maximum Input Offset Current (uA) 0.02@5V
Maximum Input Bias Current (uA) 0.05@5V
Maximum Operating Supply Voltage (V) 5.25
Maximum Supply Voltage Range (V) <5.5
Minimum CMRR (dB) 75
Minimum CMRR Range (dB) 75 to 80
Typical Voltage Gain (dB) 106.02
Typical Slew Rate (V/us) 1.8@5V
Typical Settling Time (ns) 6000
Typical Output Current (mA) 20(Max)
Typical Input Noise Voltage Density (nV/rtHz) 20@5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.85@5V
Shut Down Support Yes
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single


PACKAGE INFO
Supplier Package TSOT-23
Basic Package Type Lead-Frame SMT
Pin Count 6
Lead Shape Gull-wing
PCB 6
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.75(Max)
Package Height (mm) 0.9(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.8
Package Overall Height (mm) 1(Max)
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Terminal Width (mm) 0.45(Max)
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Small Outline Transistor
Package Family Name SOT
Jedec MO-193AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Alloy 42
 
PACKAGING INFO
Packaging Suffix TRM
Packaging Tape and Reel
Quantity Of Packaging 500
Reel Diameter (in) 7
Reel Width (mm) 8.4
Tape Pitch (mm) 4
Tape Width (mm) 8
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Q2
Packaging Document Link to Datasheet

ECAD MODELS


APPLICATIONS
• Micropower Active Filters
• Portable Instrumentation
• Battery or Solar Powered Systems
• Automotive Electronics
Продукт RFQ