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• Low Noise: 0.25ppmP-P (0.1Hz to 10Hz) 625nVP-P for the LTC6655-2.5 0.21ppmRMS (10Hz to 1kHz) for the LTC6655LN CNR = 100µF
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• Low Drift: 2ppm/°C Max
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• High Accuracy: ±0.025% Max
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| • No Humidity Sensitivity (LS8 Package) |
| • Thermal Hysteresis (LS8): 30ppm (–40°C to 85°C) |
| • Long-Term Drift (LS8): 20ppm/√kHr |
| • 100% Tested at –40°C, 25°C and 125°C |
| • Load Regulation: <10ppm/mA |
| • Sinks and Sources Current: ±5mA |
| • Low Dropout: 500mV |
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| CATALOG |
| LTC6655BHMS8-3#TRPBF COUNTRY OF ORIGIN |
LTC6655BHMS8-3#TRPBF PARAMETRIC INFO
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LTC6655BHMS8-3#TRPBF PACKAGE INFO
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LTC6655BHMS8-3#TRPBF MANUFACTURING INFO
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LTC6655BHMS8-3#TRPBF PACKAGING INFO
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LTC6655BHMS8-3#TRPBF EACD MODELS
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| LTC6655BHMS8-3#TRPBF APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Malaysia |
| Philippines |
| United States of America |
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PARAMETRIC INFO
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| Topology |
Series |
| Reference Type |
Precision |
| Output Voltage (V) |
3 |
| Initial Accuracy |
0.025% |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Typical Output Noise Voltage |
0.25ppm(p-p) |
| Supplier Temperature Grade |
Automotive |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Load Regulation |
10ppm/mA(Typ) |
| Line Regulation |
25ppm/V |
| Maximum Input Voltage (V) |
13.2 |
| Regulation Condition Change In Load |
5mA |
| Maximum Output Current (mA) |
5 |
| Maximum Temperature Coefficient |
2ppm/°C |
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|
PACKAGE INFO
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| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.86 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
4.9 |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Alloy 42 |
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PACKAGING INFO
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| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Instrumentation and Test Equipment
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| • High Resolution Data Acquisition Systems |
| • Weigh Scales |
| • Precision Battery Monitors |
| • Precision Regulators |
| • Medical Equipment |
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