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• Low Propagation Delay: 1.8ns Typ.
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• High Toggle Rate: 890Mbps Typ.
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• LVDS Compatible Output Stage
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• Rail-to-Rail Inputs Extend Beyond Both Rails
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• Low Quiescent Current: 13.4mA
|
• Supply Range: 2.4V to 5.25V
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| CATALOG |
LTC6754ISC6#TRMPBF COUNTRY OF ORIGIN
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LTC6754ISC6#TRMPBF PARAMETRIC INFO
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LTC6754ISC6#TRMPBF PACKAGE INFO
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LTC6754ISC6#TRMPBF MANUFACTURING INFO
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LTC6754ISC6#TRMPBF PACKAGING INFO
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LTC6754ISC6#TRMPBF ECAD MODELS
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LTC6754ISC6#TRMPBF APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Thailand
|
|
PARAMETRIC INFO
|
| Rail to Rail |
Rail to Rail Input |
| Manufacturer Type |
High Speed Comparator |
| Typical PSRR (dB) |
80 |
| Number of Channels per Chip |
1 |
| Output Type |
LVDS |
| Maximum Input Offset Voltage (mV) |
4@5V |
| Maximum Input Bias Current (uA) |
1.5@5V |
| Typical CMRR (dB) |
77 |
| Typical Voltage Gain (dB) |
53 |
| Typical Voltage Gain Range (dB) |
40 to 70 |
| Strobe Capability |
No |
| Typical Output Current (mA) |
20(Max) |
| Maximum Propagation Delay Time (ns) |
2.8 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Power Supply Type |
Single |
| Integrated Voltage Reference |
No |
| Maximum Operating Supply Voltage (V) |
5.25 |
| Integrated OP Amp |
No |
| Minimum Single Supply Voltage (V) |
2.4 |
| Typical Single Supply Voltage (V) |
3|5 |
| Maximum Single Supply Voltage (V) |
5.25 |
| Maximum Supply Current (mA) |
14.7@5V |
|
|
PACKAGE INFO
|
| Supplier Package |
SC-70 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.2(Max) |
| Package Width (mm) |
1.35(Max) |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TRM |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Clock and Data Recovery |
| • Level Translation |
| • High Speed Data Acquisition Systems |
| • Window Comparators |
| • High Speed Line Receivers |
| • Time Domain Reflectometry |
| • Time of Flight Measurements |
| |
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